Mezzanine Connectors have space-saving 1 mm pitch design.
September 9, 2011 -
Used for parallel board stacking interconnections, 891-10-064-30-120000 (male) and 893-43-064-30-420000 (female) are SMT, 64-position mezzanine connectors with mated height of 10 mm. RoHS-compliant products are suited for connecting common mezzanine card and may also be used as modular connectors for front panel and backplane I/O cards. Features include 30 µin. gold-plated contacts, tin-plated solder terminals, and insulator housings of high-temperature, glass-filled LCP.
Original Press release
Mill-Max Mfg. Corp.
190 Pine Hollow Rd., P.o. Box 300
Oyster Bay, NY, 11771
USA
Mill-Max Now Offers 891 & 893 1 mm Pitch Mezzanine Connectors
Mill-Max introduces 64 position, 1 mm pitch mezzanine connectors for parallel board stacking interconnections. The connectors meet EIA-700 AAAB specifications for IEEE 1386 applications.
IEEE 1386 is the industry standard for adding general functionality to motherboards and these mezzanine connectors are the perfect solution for connecting the common mezzanine card (CMC.) Some of the environments where this standard can be found are on VME, VME64 & VME64X boards, CompactPCI boards, Multibus I & II boards, desktop & portable computers and servers. They can also be used as modular connectors for front panel and backplane I/O cards.
The 891-10-064-30-120000 male and 893-43-064-30-420000 female are surface mount connectors that have a mated height of 10 mm. The 1 mm pitch provides high density packaging crucial for saving board real estate. Locating posts are incorporated into the housing to promote accurate placement on the P.C.B.
The connectors are RoHS compliant and suitable for "lead free" reflow soldering processes. Packaging is tape & reel, per EIA-783 (56 mm wide; 16 mm pitch.)
Both the 891 & 893 connectors feature 30u" gold plated contacts, providing optimum conductivity and effective wear resistance, and tin plated solder terminals for ease of soldering. The insulator housings are made of high temperature glass filled LCP, rated UL 94 V-0.
For more information, please visit: www.mill-max.com/PR623.
Mill-Max is the leading US manufacturer of machined interconnect components with a vertically integrated manufacturing facility headquartered at 190 Pine Hollow Rd., Oyster Bay, NY 11771. Its full product line includes spring-loaded connectors, SIP, DIP, PGA and BGA sockets, board-to-board interconnects and pin headers, surface mount and custom products, PCB pins and receptacles, solder terminals, wrapost receptacles and terminals. The company's complete manufacturing facility includes engineering, tooling, primary and secondary machining, stamping, plating, injection molding, and assembly.
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