Memory Testing Modules include DDR3 support.August 24, 2009 -
ScanDIMM(TM) modules provide boundary-scan testability and complete fault isolation when testing DDR3 DIMM sockets. Insertion into DIMM socket of UUT results in placing bi-directional boundary-scan cell behind each pin of DIMM connector, increasing test coverage to include data and address signal pins as well as clock, control, power, and ground pins. Cell architecture enables test pattern generation tools to apply optimal diagnostic algorithms to isolate any failure under investigation.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Corelis, Inc.
13100 Alondra Blvd.
Cerritos, CA, 90703
USA
Corelis Extends ScanDIMM(TM) Family to Include DDR3 Support
Two new DDR3 ScanDIMM(TM) modules provide extended boundary-scan testability and complete fault isolation when testing DDR3 DIMM sockets.
Cerritos, CA, August 13, 2009 - Corelis has released two DDR3 ScanDIMM modules which provide interconnect testability solutions for DDR3 sockets. Inserting the ScanDIMM into the DIMM socket of a UUT results in placing a fully bi-directional boundary-scan cell behind each pin of the DIMM connector, increasing the test coverage to include not only data and address signal pins, but also clock, control, and all power and ground pins. Utilizing this improved cell architecture, test pattern generation tools, such as Corelis' ScanExpress TPG, can apply the most optimal diagnostic algorithms to clearly isolate any failure under investigation.
DDR3 is the premier, high-performance memory solution for CPU systems pushing the envelope in key areas like power consumption, signaling speeds, and bandwidth, while bringing new levels of performance to desktop, notebook, and server computing. DDR3 supports data rates of 1333 to 1600 MT/s, with clock frequencies of 667 to 800 MHz respectively, providing superior performance over DDR2. In addition, DDR3's standard 1.5V supply voltage cuts power consumption by up to 30% over DDR2.
Ryan Jones, Senior Technical Marketing Engineer at Corelis states, "DDR3 has gained significant market acceptance for a wide range of circuit board applications, effectively driving demand for a DDR3 boundary-scan test solution. The DDR3 ScanDIMM modules are indicative of Corelis' commitment to providing a complete arsenal of boundary-scan test tools to meet that demand."
DDR3 ScanDIMM modules are fully compatible with Corelis' ScanExpress family of software products and come complete with all necessary cabling. 240-pin and 204-pin form factors are offered with both standard and mirrored pin-outs available in the 204-pin package. They conform to JEDEC mechanical specifications, MO-269F and MO-268C respectively, and are available from stock with a list price of $1,500.
About Corelis
Corelis, Inc., a subsidiary of Electronic Warfare Associates, Inc., offers bus analysis tools, embedded test tools and the industry's broadest line of JTAG/boundary-scan software and hardware products combining exceptional ease-of-use with advanced technical innovation and unmatched customer service. Corelis' development and test tools are used by companies such as Agilent, Dell, IBM, Jabil, Intel, Microsoft, Lockheed Martin, Rockwell Collins, Hewlett-Packard, Motorola, Qualcomm, Nokia, Panasonic, TI, Ford, Plexus, Broadcom, Ericsson, Flextronics, and many others. Corelis products are found globally in every industry developing or manufacturing electronic products.
Copyright © 2009 Corelis, Inc. All rights reserved.
All company and product names may be trade names, trademarks, or registered trademarks of the respective owners with which they are associated. Features, pricing, availability, and specifications are subject to change without notice.
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