Product News: Computer Hardware & Peripherals

Memory Modules feature low profile design.

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Press Release Summary:

March 7, 2014 - Supplied in Ultra-Low Profile 0.70 in. and Very-Low Profile 0.738 in. form factors, respectively, 16 GB and 32 GB DDR3 RDIMM products are suitable for server blades, telecom, and networking applications that require low profile memory. Both are ECC Registered and are available in 1.35 and 1.5 V configurations. In addition, both series can be screened for extended temperature operation.

Virtium

30052 Tomas, Rancho Santa Margarita, CA, 92688, USA

Original Press Release

Virtium Introduces New DDR3 16GB ULP RDIMM and 32GB VLP RDIMM Memory Modules

Press release date: February 26, 2014

New Modules Feature Industry-Leading Density and Cutting-Edge DDR3 Technology Achieved at Lower Competitive Price Points

RANCHO SANTA MARGARITA, Calif. — Virtium, a leading provider of embedded SSD and industrial memory modules, today introduced two new DDR3 16 gigabyte (GB) and 32 gigabyte (GB) DDR3 RDIMM in the Ultra-Low Profile (ULP) 0.70-inch and Very-Low Profile (VLP) 0.738-inch form factors respectively.  Virtium’s new memory modules enable customers to add more memory with high density modules at DDR3 speeds achieved at a lower competitive price point. Using Virtium’s advanced design process; these modules also deliver lower power consumption and enable improved airflow for today’s feature-rich industrial embedded systems.  The new Virtium 16GB DDR3 ULP RDIMM and 32GB DDR3 VLP RDIMM products are ideal for server blades, telecom and networking applications that require low profile memory.

Designed to offer high availability, the new Virtium 16GB DDR3 ULP RDIMMs and 32GB DDR3 VLP RDIMMs allow for higher system throughput and cooler operation.  Virtium has applied a new layout technique that reduces the module’s overall thickness while doubling density.  Both module series are ECC Registered and are available in both 1.35V and 1.5V configurations. Additionally, both series can be screened for extended temperature operation.

"We designed Virtium’s two new DDR3 ULP and VLP memory modules  with the key features our OEM customers need all at a solid price point to meet their budget and product differentiation goals," said Phan Hoang, vice president of research and development at Virtium.  “These new modules also deliver the lower power consumption and improved airflow performance that today’s compact applications require while providing embedded system designers with the memory densities needed to increase system throughput and the ability to migrate to equivalent DDR4 densities.”

For more information about Virtium’s DDR3 memory modules:  http://www.virtium.com/VLP

About Virtium
Virtium is a solutions-driven provider of embedded SSD and industrial memory products OEMs trust for their networking, communications, industrial, in-flight entertainment, transportation, gaming and mobile monitoring system applications.  Virtium excels at both first-to-market solutions and unsurpassed continuity of support for legacy products that meet the performance, workload and product deployment requirements of its customers.

Virtium is known as a storage and memory technology innovator.  The company is a driving force in the continuous advancement of embedded SSDs and memory modules that deliver the capacity, form factor, extended temperature, ruggedization and configuration improvements that help OEMs compete successfully.

For more information on Virtium and its other memory and storage products, please visit www.virtium.com.

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