Manufacturing Software optimizes jetting underfill for flip chips.
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Press Release Summary:
Used for jetting underfill for flip chips, Continuous Path Motion Control software optimizes dispense head motion to conserve time and increase units per hour (UPH). Dispense head maintains continuous speed and direction throughout process instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating. Depending on actual die layout, dispensing conditions, flow rate, and other factors, software conserves 23% dispensing cycle time at 9 mg/sec flow rate.
Original Press Release:
Nordson ASYMTEK Introduces Continuous Path Motion Control Software
~ Improves dispensing speed for underfilling flip chips ~
Photo available at:Â Â http://www.nordson.com/en-us/divisions/asymtek/PublishingImages/PR/High-Res/NordsonASYMTEK-Continuous-Path-Motion-Control.jpg
Carlsbad, CA, USA -- Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN, a leader in dispensing, coating, and jetting technologies, has developed Continuous Path Motion Control software for jetting underfill for flip chips. The software optimizes dispense head motion,saving time and increasing units per hour (UPH). Instead of stopping to move between die, backtracking, ramping to speed, dispensing, and decelerating, the dispense head maintains a continuous speed and direction throughout the process.
When cycle time test data of 20 strips with 70 die on a strip was evaluated using Continuous Path Motion Control as compared to conventional underfill methods that use backtracking, there was about a 27% improvement in UPH with Continuous Path. This was due to a 40% dispensing cycle time savings at 15mg/sec flow rate and 95mm/sec speed. (This doesn't include loading and unloading.) The Continuous Path increases UPH even when compared to underfill methods that don't include backtracking because stop-and-go movements between the die are eliminated. Continuous Path Motion Control software saves 23% dispensing cycle time at 9mg/sec flow rate depending on actual die layout, dispensing conditions, flow rate, and other factors.
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"An expanding number of applications are using flip chip package devices with rigid substrates and parts that are smaller and closer together," explained Akira Morita, product development manager, Nordson ASYMTEK. "These devices have different configurations in terms of die size, die thickness, bump numbers, bump pitch, bump gap, and substrate size. This changes the amount of underfill needed and the fluid flow speed (bump gaps and die thicknesses are different). A thinner line of fluid has to be deposited because the space between the die is narrower. Continuous Path Motion Control speeds up the dispensing process for these new applications."
Read the article "Underfilling Using Continuous Path Motion Control" and see a video showing the increased speed you get from Continuous Path Motion Control at:
http://www.nordson.com/en-us/divisions/asymtek/products/Software/Pages/Continuous-Path-Motion-Control.aspx
About Nordson ASYMTEK
Nordson ASYMTEK, a world leader in precision automated fluid dispensing, conformal coating, and jetting technologies, designs and manufactures dispensing and coating systems, supported by an award-winning global applications and service network. Celebrating over 30 years in business, Nordson ASYMTEK is continually recognized for innovative equipment and excellent service, and is ISO 9001 certified. The company offers advanced dispensing solutions for precision assembly processes, including semiconductor packaging, printed circuit boards, LEDs, flat panel displays, medical and biotechnical devices, and solar and photovoltaic products. To find out more, visit www.NordsonASYMTEK.com, Facebook.com/NordsonASYMTEK or Twitter.com/NordsonASYMTEK.
About Nordson Corporation
Nordson Corporation (NASDAQ: NDSN) delivers precision technology solutions that help customers increase speed, productivity and up-time, enable new products and features, and decrease material usage. The company engineers, manufactures and markets differentiated products and systems used for dispensing adhesives, coatings, sealants, biomaterials and other materials, fluid management, testing and inspection, and UV curing and surface plasma treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, building and construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson at www.nordson.com, twitter.com/Nordson_Corp, or Facebook.com/Nordson.
For more information contact:
Nordson ASYMTEK Headquarters:
Roberta Foster-Smith
Tel: +1.760.431.1919
Email: roberta.foster-smith@nordsonasymtek.com
Agency Contact:
Andrea Roberts
A R Marketing, Inc.
Tel: +1.858.451.8666
Email: andrea@armarketinginc.com
International Offices:
Headquarters: 2747 Loker Ave. West, Carlsbad, CA 92010 USA
Tel: +1 760 431 1919 www.nordsonasymtek.com
China: +86 21 3866 9166 www.nordsonasymtek.com/cn
Europe: +31 43 352 4466
India: +91 44 4353 9024
Japan: +81 3 5762 2801 www.nordsonasymtek.com/jp
Korea: + 82 31 765 8337 www.nordsonasymtek.com/kr
Southeast Asia: +65 6796 9515
Taiwan: +886 2 2902 1860
