Low-Profile 0603 Diplexer targets multiband applications.
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Press Release Summary:
Based on multilayer organic high density interconnect technology, 0603 MLO™ diplexer (part No. DP03B5425TTR) measures 0.065 x 0.035 x 0.017 in. and supports multiple wireless standards: WCDMA, CDMA, WLAN, GSM, and BT. Expansion matched to PCBs promotes reliability, and available finishes of Ni Au, Ni Sn, and OSP are compatible with automatic soldering technologies. Diplexers are suited for band switching in dual- and multiband applications, such as WiFi, WiMax, GPS, and cellular bands.
Original Press Release:
AVX Releases New Low-Profile 0603 MLO Diplexer for Multiband Applications
Ideal for band switching in dual- & multiband applications, the new 0603 diplexers provide improved reliability over comparable ceramic or silicon components
GREENVILLE, S.C. — AVX Corporation, a leading manufacturer of advanced passive components and interconnect solutions, announced its new low-profile 0603 diplexer at the International Microwave Symposium in Seattle, Wash. today. Based on the company’s patented multilayer organic high density interconnect technology, the new 0603 MLO™ diplexer (part number: DP03B5425TTR) employs high dielectric constant and low loss materials to realize high Q passive printed elements, such as inductors and capacitors in a multilayer stack up. Capable of supporting multiple wireless standards, including: WCDMA, CDMA, WLAN, GSM, and BT, the 0603 diplexers are ideally suited for band switching in dual- and multiband applications, such as WiFi, WiMax, GPS, and cellular bands.
Utilizing land grid array packaging technology, AVX’s new 0603 diplexers have an inherently low profile (0.5mm) and exhibit excellent solderability, low parasitics, and high heat dissipation. Expansion matched to PCBs, the diplexers also provide improved reliability with regards to comparable ceramic or silicon components.
“Our 0805 MLO™ diplexer, released earlier this year, has been well received within the RF industry, so we’re very pleased to be able to release the smaller form factor here at the International Microwave Symposium,” said Larry Eisenberger, senior marketing application engineer at AVX.
AVX’s new 0603 MLO™ diplexer features a maximum power capacity of 4.5W, measures 1.65mm x 0.88mm x 0.42mm (0.065” x 0.035” x 0.017”), is rated for use in temperatures ranging from -40°C to +85°C, and is available in Ni Au, Ni Sn, and OSP finishes, all of which are compatible with automatic soldering technologies. Finished parts are 100% tested for electrical parameters and visual characteristics and are packaged on tape and reel.
Visitors to the International Microwave Symposium exhibition, June 4th – 6th, can learn more about AVX’s new 0603 MLO™ diplexer and its full catalogue of passive components for RF and microwave applications at the AVX booth, #1927.
For more information, please visit www.avx.com, call 864-967-2150, or write to One AVX Boulevard, Fountain Inn, S.C. 29644.
About AVX
AVX Corporation is a leading international supplier of electronic passive components and interconnect solutions with 26 manufacturing and customer support facilities in 15 countries around the world. AVX offers a broad range of devices including capacitors, resistors, filters, timing and circuit protection devices and connectors. The company is publicly traded on the New York Stock Exchange (NYSE:AVX).
