Low-Power DSP delivers up to 200 MHz performance.May 29, 2014 -
Offering combination of low stand-by and low active power, Model TMS320C5517 is suited for battery-powered, portable systems requiring analytics, such as smart products offering face detection, object tracking, and voice recognition. McSPI operates in master or slave modes and enables low-power analytics through connectivity to external sensors. Allowing customers to connect to standard codecs, McBSP serial port supports continuous full-duplex communication and up to 128 channels in TDM mode.
Power-hungry Audio and Video Analytic Applications Have Met Their Match with Next-generation Ultra-low-power DSP from TI
Texas Instruments, Inc., Semiconductors
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Dallas, TX, 75243
Press release date: May 20, 2014
New TMS320C5517 DSP from Texas Instruments offers developers high performance and an expansive peripheral set at low power
DALLAS, May -- Today, Texas Instruments (TI) (NASDAQ: TXN) introduces the next-generation, ultra-low-power DSP in TI's scalable TMS320C5000(TM) device portfolio, the TMS320C5517 (C5517). The new DSP delivers up to 200 MHz performance enabling faster processing of data with low-power consumption for demanding applications, such as audio and video, biometrics and other analytic specific applications. These applications are opening up a world of possibilities that add capabilities such as face detection, object tracking and voice recognition to a new generation of smart products. Along with the improved performance, the C5517 DSP also offers a compelling combination of low stand-by and low active power, making it the best choice for battery-powered, portable systems requiring analytics.
Scaling the C5000 DSP portfolio
With the addition of this full-featured C5517 DSP, TI now offers a scalable C5000(TM) device portfolio with lower performance (50/100 MHz) C5535 DSPs to mid-range (120/150 MHz) C5514/15 DSPs and now high performance with the newest C5517 DSP (200 MHz).
Features and benefits of the C5517 DSP:
-- Enable external sensor connectivity. The McSPI enables low-power analytics through connectivity to external sensors. It operates in master or slave modes, as well as adds to the standard SPI ports on the device to support greater serial connectivity.
-- Connect to standard codecs such as EICs D/A, A/D and more. McBSP is a flexible serial port that allows customers to connect to standard codecs. It also enables continuous full-duplex communication and supports up to 128 channels in TDM mode.
-- Simplify communication between processors. The Universal Host Port Interface (UHPI) is an easy way for a host processor to connect to the DSP while allowing direct access to the DSPs memories for sharing of data between elements
-- Build smaller hardware for space-constrained applications. Customers can pack signal processing performance into systems with challenging space and power restrictions due to the C5517 DSPs small 10x10 footprint and ultra-low power operation.
-- Enhance and extend product lines. The C5517 DSP offers a greater number and variety of peripherals and greater signal processing performance than previous members of TI's ultra-low-power DSP family. This enables developers to add new capabilities or improve analytic performance of an existing product line, while leveraging the same tool and software basis previously used.
Simplifying development with a scalable software solution
The new C5517 DSP is software compatible with previous C5000 devices, which allows existing customers to easily take advantage of the new features and 200 MHz operation. In addition to software compatibility, TI offers a complete tool chain which includes a full chip support library that customers can use to start their designs. C5517 DSP customers also have access to tips from TI's experienced partners and active TI E2E(TM) communities from whom they can get advice, recommendations and support for their designs. For example, one of the third-party developers, SNAP Sensor technology, helps turn TI's C5517 DSP into a machine vision solution with their specific hardware, software and vision module.
"The C5517 solution enables rapid development and customization of vision sensing applications. Working with TI allowed us to create a cost and power optimized people sensing and information extraction solution," said Pascal Nussbaum, SNAP Sensor CTO. "The SNAP Suite development environment facilitates quick and easy vision application development on a video stream powered by the C5517 DSP. This SNAP Sensor module will be available in June."
Availability and pricing
TI's C5517 EVM is available now through TI distribution partners or TI.com for $499 and includes a TPS65023 integrated power management step-down converter to manage the power. Additionally, the silicon is sampling now for $9.05/1KU.
For more information:
-- See how the C5517 DSP is a great fit for analytics in this Ask The Experts video
-- Keep up with the latest DSP happenings on the Multicore Mix blog
-- Engage with engineers and TI experts on the TI E2E(TM) Community
-- Follow TI on Twitter
-- Become a fan of TI on Facebook
About Texas Instruments
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world's brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today. Learn more at www.ti.com.
TMS320C5000, C5000 and TI E2E are trademarks of Texas Instruments Incorporated. All trademarks are the property of their respective owners.
Web Site: http://www.ti.com