Product News: Packaging Equipment, Electronic Components & Devices
Lids and Covers hermetically seal microelectronic devices.
Press Release Summary:
February 10, 2014 - Available with screened or affixed getters for moisture or hydrogen absorption, Step Lids, Flat Lids, and Covers can be manufactured from variety of base materials, including Kovar, nickel alloys, stainless steel, cold rolled steel, titanium, and aluminum. Finishing/plating options include gold, electrolytic nickel, and electroless nickel. Selective plating or etching of logos, part numbers, or serialization is also available upon request.
Original Press Release
PEI Expands Product Line of Lids and Covers for Microelectronic Devices
Press release date: January 14, 2014
Custom and standard lids now available with getters
Milford, MA, …Using the photochemical etching process, Photofabrication Engineering, Inc.(PEI) specializes in manufacturing step lids, flat lids and covers to hermetically seal high-reliability microelectronic devices using resistance welding. The company can provide lids with getters screened or affixed to the lid for moisture or hydrogen absorption, which greatly increases the product life span. Both standard lid sizes and shapes to meet almost every common specification, or custom-designed lids are available; customers can design their own custom lids using our Lid Generator Form at http://www.photofabrication.com/lid-generator-access.
PEI’s lids and covers can be manufactured from a wide variety of base materials including Kovar, nickel alloys, stainless steel, cold rolled steel, titanium, and aluminum. There is a wide range of finishing/plating options available such as gold (per MIL-G-45204B Type III), electrolytic nickel (per QQ-N-290 ) and electroless nickel (per MIL-C-26074). Selective plating or etching of logos, part numbers or serialization is also available upon request.
PEI provides lids and covers to the microwave, aerospace, hybrid/OEM, defense/military, telecommunications/data communications, medical product manufacturing, solar power, and related industries. Our extensive history in producing microelectronic package components has made us one of the leading suppliers to microelectronic and semiconductor manufacturers.
Established in 1968, Photofabrication Engineering, Inc. is a world-famous American precision metals fabricator which has developed proprietary metal etching processes to create precision metal parts in thicknesses from 0.0005 in. to 0.125 in. The firm is ITAR compliant and holds ISO 9001:2008 and AS9100 certifications. The Precision Products Division serves myriad manufacturing industries including aerospace, automotive, battery, consumer electronics, defense, fuel cell, medical (devices as well as implantables), microelectronics, semiconductor, and telecommunications. All of PEI’s products are proudly made in the USA, and PEI guarantees short lead times, quick response to customer needs, and products that meet the highest quality standards.
For more information about Photofabrication Engineering and its manufacturing capabilities, visit our web site at http://www.photofabrication.com, or contact Judy Grande, Marketing Manager, at Photofabrication Engineering, Inc., 500 Fortune Boulevard, Milford, MA 01757, USA, phone 508-478-2025, fax 508-478-3582, e-mail email@example.com.