Laminate IC Packages dissipiate heat from high-power devices.
June 28, 2012 -
Measuring 0.8 x 0.39 in., LL family of leaded laminate copper-moly-copper base packages include model LL802302, with 2 leads and raised lid with epoxy seal, and LL362302 flangeless, fully hermetic version with flat ceramic lid. Packages dissipate heat from compound semiconductor devices such as GaN, GaAs, and SiC. Suitable for applications through 6 GHz, both units can be used in RF radios for communications, radar, and high-power millimeter-wave signals.
|Original Press release |
4393 Viewridge Ave
San Diego, CA, 92123
StratEdge Introduces Laminate Packages for High Power GaN Devices
- Copper-moly-copper packages dissipate heat -
See StratEdge at IMS2012 Booth #1625
San Diego, Calif - StratEdge Corporation, leader in the design and production of high performance semiconductor packages for microwave, millimeter-wave, and high speed digital devices, introduces a new family of high power laminate packages at IMS2012 Booth #1625. The LL family of leaded laminate copper-moly-copper (CMC) base packages dissipates heat from high power compound semiconductor devices, such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These packages handle applications through 6 GHz for use in RF radios for communications, radar, and high power millimeter-wave signals.
The series includes two laminate power packages, both with a ratio of 1:3:1 CMC, which provides a good thermal match for alumina-based materials and a GaN chip. The LL802302 is 0.8" (20.32mm) long x 0.39" (9.91mm) wide with 2 leads and a raised lid with an epoxy seal. This is a flange package with a bolt hole on each end so the package can be bolted to the printed circuit board. The LL362302 is a flangeless, fully hermetic version of the LL802302 package, and has a flat ceramic lid. StratEdge offers both flange and flangeless styles to accommodate manufacturing processes to either bolt down or solder the package. Hermeticity is especially critical in aerospace and defense applications.
"StratEdge's new laminate power packages solve thermal problems encountered when using GaN devices," explained Tim Going, StratEdge president. "The excellent thermal conductivity of the CMC base enables use of GaN devices in high power applications, and the flange package facilitates manufacturing. StratEdge is continuing to develop packages to handle the requirements of today's new materials and devices."
IMS2012 is being held in The Palais de Congres, Montreal, Canada from June 19-21, 2012. Visit StratEdge at booth #1625 to discuss your packaging requirements.
StratEdge Corporation, founded in 1992, designs, manufactures, and provides test and assembly services for a complete line of high performance semiconductor packages operating from DC to 50+ GHz for the high speed digital, mixed signal, broadband wireless, satellite, point-to-point/multipoint, VSAT, and test and measurement industries, as well as aerospace stripline filters. StratEdge offers ceramic, low cost molded ceramic, and metal packages. All packages are lead-free and most meet RoHS and WEEE standards. For more information contact StratEdge Corporation at 866-424-4962, email: email@example.com, or visit our website at www.stratedge.com.