LDO Voltage Regulator ICs feature 850 mW power dissipation.
February 22, 2011 -
Housed in 0.8 x 0.8 x 0.4 mm package, S-1312/1313 Series features ultra-low 20 µA/0.9 µA current consumption and ripple rejection of 75 dB. Thermal shutdown capability automatically protects circuit when junction temperature reaches 150°C and restarts regulation when it drops to 120°C. With outer lead design that minimizes failure rates related to circuit board flexing and mechanical shock, ICs are suited for smart phones, cell phones, digital cameras, and notebook PCs.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
|Original Press release |
Seiko Instruments U.S.A., Inc.
2990 W. Lomita Blvd.
Torrance, CA, 90505
Seiko Instruments Introduces New Ultra-Small LDO Voltage Regulator ICs
- S-1312/1313 Series LDO voltage regulator ICs enable high component density designs, excellent power dissipation, and thermal shutdown protection, in addition to improving device reliability -
TOKYO, -- Seiko Instruments Inc. (SII) announced on February 15 the S-1312/1313 series, the world's smallest outer lead package (0.8 x 0.8 x 0.4 mm) LDO voltage regulators, featuring 850 mW power dissipation, thermal shutdown capability, high ripple rejection, and ultra-low 0.9-micro-ampere current consumption. The new regulators have been optimized for use in smart phones, cellular phones, digital cameras, notebook PCs, hearing aids, and other battery operated portable device designs.
Thermal shutdown protection is built-in, automatically protecting the circuit when the junction temperature reaches 150 degrees C and restarts regulation when it drops to 120 degrees C. Overcurrent protection is also a built-in feature.
Current consumption has been reduced to extremely low levels (S-1313: 0.9 micro amperes and S-1312: 20 micro amperes) extending battery and device operating times, while providing excellent ripple rejection of 75 dB (typical). Output voltage is maintained with high accuracy within +/- 1.0%.
Utilizing SII's HSNT-4(0808) ultra-small package (0.8 x 0.8 x 0.4 mm), the regulators occupy only one-third the area of conventional SNT-4 package regulators, while enabling automatic visual solder joint inspection, improving manufacturing yields and reliability. The package incorporates a heat sink capable of 850 mW dissipation (board size 40 x 40 x 0.8 mm, 4 layers, copper ratio 50%), providing higher reliability and performance.
The outer lead design also decreases failure rates related to circuit board flexing and mechanical shock. This is particularly important for small consumer devices like smart phones that are subjected to constant use.
Both regulators are also available in SOT-23-5 and SC-82AB packages.
Chinese Simplified: http://www.sii-ic.com/cn
About Seiko Instruments Inc. (SII)
Major subsidiary of Seiko Holdings Corporation (TSE: 8050). Develops, manufactures and sells watches, precision components and machine tools, electronic components, communication products and solutions, printers, measurement and analysis instruments.
Please visit http://www.sii.co.jp/corp/eg/index.html
CONTACT: Tomohiro Io, Corporate Communications Dept., Seiko Instruments Inc., +81-43-211-1111, firstname.lastname@example.org
Web Site: http://www.sii-ic.com/en