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Ion Implanters are suited for advanced 3D devices.
Press Release Summary:
February 18, 2014 - Purion M™ mid current implanter, Purion H™ high current implanter, and Purion XE™ high energy implanter are designed for advanced 3D devices. Systems include Purion Contamination Shield™ for lowest particles, undetectable metals, and no energy contamination; Purion Vector™ Dose and Angle Control system for precise and repeatable dopant placement; as well as Purion 500wph endstation cross-platform architecture that promotes productivity and manufacturing flexibility.
Original Press Release
Axcelis Debuts the Purion Platform at SEMICON Korea 2014
Press release date: February 10, 2014
Industry's Most Powerful Platform Delivers Unmatched Purity, Precision and Productivity for Advanced 3D Device Manufacturing
BEVERLY, Mass. – Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, announced today that it will showcase its new Purion™ Platform of ion implanters at SEMICON Korea 2014. The event, one of the most important technology forums in the Asia Pacific region, is being held February 12(th) -14th, at the COEX Center in Seoul, Korea. It will feature over 530 companies from 20 countries with a record 1,737 exhibition booths focused on new products and technologies for microelectronics design and manufacturing.
Bill Bintz, executive vice president, engineering and marketing, commented "We are excited to participate in SEMI Korea and debut our innovative new Purion platform. Korea is one of the most important regions for chip manufacturing, driving innovation for the mobile era. As they transition to sub 16nm 3D device manufacturing, they can rely on Axcelis to provide the industry's best overall technical and manufacturing implant solution."
To learn more, visit the Axcelis showcase at #5506 in Hall D. Axcelis Purion experts will be available to discuss the following innovations:
-- The industry's first complete implant platform designed specifically for advanced 3D devices, including the Purion M™ mid current implanter, the Purion H™ high current implanter and the Purion XE™ high energy implanter.
-- Purion Contamination Shield™ for lowest particles, undetectable metals and no energy contamination for highest possible device yield.
-- Purion Vector™ Dose and Angle Control system for precise and repeatable dopant placement for unparalleled precision engineering.
-- Purion 500wph endstation, a common, cross-platform architecture that delivers the industry's highest productivity and manufacturing flexibility.
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 35 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.