Interconnect Flux is water-soluble.
July 29, 2004 -
Designed for use in BGA bumping and board level attachment, WS-364 water-soluble paste-flux can be applied by pin-transfer or stencil printing. It can be cleaned using room-temperature water and offers high yield in BGA bumping process. Available in syringes or cartridges, halide-free product is suitable for Sn/Pb and Pb-free applications.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Indium Corporation
1676 Lincoln Ave., P.O. Box 269
Utica, NY, 13502
USA
Indium Corporation Introduces New Interconnect Flux
Indium Corporation has introduced a new high viscosity paste-flux, called WS-364, designed for use in BGA bumping and board level attachment. This new water-soluble flux has excellent cleanability using room temperature water.
With a wide process window, WS-364 can be applied by pin-transfer or stencil printing and offers exceptionally high yield in the BGA bumping process. Halide-free with excellent solderability, WS-364 is suitable for Sn/Pb and Pb-free applications and is available in syringes or cartridges.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.
For more information on WS-364, visit Indium Corporation of America at www.indium.com or email askus@indium.com.
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