Product News: Test & Measuring Instruments
Inline PCB Inspection System utilizes 9 MP color camera.
Press Release Summary:
April 2, 2014 - With 1 top-down viewing camera, 4 side-viewing cameras, and 3D inspection, Model FX-940 is suitable for inspection of solder defects, lead defects/lifted leads, component presence/position, correct part/polarity, through-hole parts, and co-planarity of chips and BGAs. System is configurable for all line positions and equally effective for paste, pre/post-reflow, and final assembly inspection. Other features include real-time SPC monitoring and Advanced Fusion Lighting.
2747 Loker Avenue West, Carlsbad, CA, 92010, USA
Original Press Release
Nordson YESTECH to Debut FX-940 Inline PCB Inspection System with 3D Inspection Capability at APEX
Press release date: March 1, 2014
Carlsbad, CA —Nordson YESTECH, a subsidiary of Nordson Corporation (Nasdaq: NDSN) will debut its FX-940 AOI Inline PCB inspection system in Booth #2025 at the upcoming IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, USA. The FX-940 is the latest automated solution for the inspection of solder defects, lead defects/lifted leads, component presence and position, correct part/polarity, through-hole parts, and co-planarity of chips, BGAs and other height-sensitive devices.
Nordson YESTECH’s advanced nine megapixel color camera imaging technology offers high-speed PCB inspection with exceptional defect coverage. With one top-down viewing camera, four side-viewing cameras and 3D inspection, the FX-940 inspects solder joints and verifies correct part assembly, enabling users to improve quality and increase throughput.
Configurable for all line positions, the FX-940 is equally effective for paste, pre / post-reflow and final assembly inspection. Fast and intuitive off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution.
The FX-940 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines. Advanced Fusion Lighting and newly available image processing technology integrates several techniques including 3D inspection, color inspection, normalized correlation and rule-based algorithms to provide complete inspection coverage with an unmatched low false failure rate.
For more information about Nordson YESTECH, visit www.nordsonyestech.com.
About Nordson YESTECH
Headquartered in Carlsbad, California, Nordson YESTECH is a leading provider of automated optical and high-resolution x-ray inspection systems, with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconductor-packaging industries, Nordson YESTECH is operated and managed by a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales offices and customer support centers in North America, Asia and Europe. For more information on Nordson YESTECH and its products, visit www.nordsonyestech.com.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp or www.facebook.com/nordson