Industrial Picosecond Lasers enable machining of thick materials.
September 10, 2013 -
Talisker HE series offer output options – 200 µJ pulse energy in NIR (1,064 nm), 120 µJ per pulse in green (532 nm), 40 µJ pulse energy in UV (355 nm) – that enable drilling, cutting, and scribing of thick materials. Lasers are optimized for pointing stability and use Cold Ablation, which promotes process quality with minimal heat affected zone and no unwanted melt debris. As pulse energy extends optical depth of focused beam, cold ablation occurs throughout full thickness of material.
|Original Press Release |
Coherent Inc., Laser Group
5100 Patrick Henry Dr.
Santa Clara, CA, 95054-1112
High Energy Picosecond Pulses Enables Machining Thicker Materials
Santa Clara, Calif. – Coherent, Inc. (Santa Clara, CA) (Nasdaq: COHR) has expanded their family of industrial ultrafast lasers with the Talisker HE series, whose high energy pulses enable drilling, cutting and scribing of thicker materials than with other ultrafast lasers. Talisker HE lasers are available with a choice of output options; 200 µJ pulse energy in the near-IR (1064 nm), 120 µJ per pulse in the green (532 nm), or 40 µJ pulse energy in the ultraviolet (355 nm). Talisker HE is ideal for high-throughput, precision materials processing in industries such as automotive, biomedical, consumer electronics, mobile display & 3D semiconductor.
Talisker lasers are a family of industrial picosecond products, well documented to deliver higher quality process finished goods than conventional pulsed lasers or non-laser micromachining methods. Picosecond lasers achieve the quality improvement using a process known as ‘Cold Ablation’, due to negligible unwanted thermal effects. The result is improved process quality with minimized heat affected zone (HAZ) and no unwanted melt debris.
Cold Ablation occurs when the intensity of the laser beam exceeds the ablation threshold. The pulse energy of the new Talisker HE series is significantly higher than other lasers in the Talisker family. The significantly higher pulse energy extends the optical depth of the focused beam so that cold ablation occurs throughout the full thickness of the target material, eliminating thermal debris.
The higher energy pulses are used in a variety of materials processing techniques. Single shot pulses replace percussively drilled holes; very thick materials are drilled with reduced taper; engraving and trepanning benefit from deeper, high aspect ratio structuring.
The Talisker HE distinguishes itself with superior pointing stability. Pointing stability is critical to drilling thick materials where the pulses must be directed to the target with dependable accuracy. The maximum material thickness is ultimately limited by a combination of the laser pulse energy and the pointing stability.
Founded in 1966, Coherent, Inc. is a world leader in providing photonics based solutions to the commercial and scientific research markets, and is part of the Standard & Poor’s SmallCap 600 Index and the Russell 2000. Please direct any questions regarding this press release to Mark Thompson, Senior Product Manager, at +44-(0)141 945 8269. For more information about Coherent, including product and financial updates, visit our website at http://www.Coherent.com.