Industrial Computer supports Intel® Core(TM) i5 and i7 CPUs.
November 4, 2011 -
Built for long-term field performance, LEC-2220 employs Intel® HM55 chipset and comes in enclosed chassis with externally replaceable fan. DVI-I and DVI-D interfaces output HD-quality graphics and provide dual-screen support. DDR3 memory can be upgraded up to 8 GB, and Mini-PCIe card is attached to SIM card reader for 3G and GPS type applications. Optionally available with extra singular PCI or PCIe or 2 PCI slots, IPC comes with 6 serial, 2 GbE, 4 USB, and DIDO as standard I/O.
Original Press release
Lanner Electronics Inc.
7F, 173, section 2 Datong road
Sijhih City, , Taipei 221
Taiwan
Lanner Releases High-Performance Industrial PC with Intel® Core i5 and i7 Support
(Taipei, Taiwan) Today Lanner Electronics Inc., released its highest performance IPC so far, the LEC-2220. This platform is made for the Intel® Core i5 and i7 processors and features dual-screen support, several expansion slots and an easily maintained fan solution. Engineered for long-lasting field performance, the LEC-2220 is able to manage almost any IPC task.
The LEC-2220 comes equipped with the Intel Core i5 / i7 and the Intel HM55 chipset. This Intel Core chip and chipset offers significant improvements in thermal conductivity and power use. There are also improvements in graphics performance, which enables HD-quality output. The 2 video out ports along the front face of the LEC-2220 are DVI interfaces. One is a DVI-I interface the other is a DVI-D. Both offer HD-quality output and with the Intel HD graphics chip both can be used at the same time so LEC-2220 can provide output for 2 HD screens.
The system uses DDR3 memory that can be upgraded up to 8 GB. Like many other Lanner industrial computers, LEC-2220 offers expansion slots for end user applications. The LEC-2220 however, also allows users to choose their expansion slots. Every model comes with a Mini-PCIe card attached to a SIM card reader for 3G and GPS type applications, but users also have the option to order the LEC-2220 with an extra PCI slot, PCIe slot or even 2 PCI slots.
"With such a high-performance system, we felt that customers needed more customizable expansion options," said Spencer Chou, Product Planner at Lanner's Applied Computing Division. "The additional expansion slots have already been used for many interesting applications, such as a 6-screen digital signage display and a shipping crane controller. In the future we plan to offer such flexible expansion options with all our high-performance industrial computers."
Another new feature in the LEC-2220 is the externally replaceable fan. The LEC-2220 is built for high processing power and therefore needs a fan to cool down. Unlike competitor solutions, the LEC-2220 has an enclosed chassis with a fan that sits on top of the unit. This fan blows the warm air out of the aluminum chassis and can be easily replaced without actually opening the chassis.
Other I/O includes six serial ports, two Intel Gigabit Ethernet ports, four USB ports and DIDO. The serial ports come with different interfaces: two in the DB9 form factor, one of which is capable of carrying RS-232 signals and another capable of carrying RS-232, 422 and 485 signals. The other four serial ports are connected via a terminal block, three of these are capable of carrying RS-232 signals, while the last one can carry RS-232, 422 and 485. The Intel Ethernet ports are in the RJ-45 form factor and uses Intel 82574L network controllers.
For more information about the Lanner LEC-2220 please check out the datasheet here:
http://www.lannerinc.com/Embedded_Com....
Or you can talk to a Lanner representative at contact@lannerinc.com.
About Lanner
Lanner Electronics Inc (TAIEX 6245) is a world leading provider of design, engineering and manufacturing services for advanced network appliances and rugged applied computing platforms. Founded in 1986, Lanner is an ISO 9001 accredited organization with headquarters in Taipei, Taiwan, and offices in USA, Canada and China. Lanner is an Associate Member of the Intel® Embedded and Communications Alliance, a group of companies committed to developing modular, standards-based solutions based on technologies, processors, products, and services from Intel®.
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