IC comes with 90 nm eDRAM for mobile VGA graphic application.
August 29, 2008 -
Designed for mobile phones, music players, and other portable devices, Model µPD809400 integrates 8 megabits of embedded DRAM memory with graphics processing logic and high-speed graphics data interface, displaying 24-bit full color image data on VGA panels. Fabricated with 90 nm process technology, it integrates large memory, timing control circuits, as well as regulators and other analog circuits. Chip is also capable of expanding QVGA data for display on VGA screens.
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Original Press release
NEC Electronics
2880 Scott Blvd.
Santa Clara, CA, 95050
USA
NEC Electronics Announces SoC with 90-nm eDRAM for Mobile VGA Graphics Applications
KAWASAKI, Japan, May 29, 2008
NEC Electronics Corporation(TSE6723) today announced that it starts shipment of the µPD809400 for mobile phones, music players, and other portable devices that integrates 8 megabits of embedded DRAM (eDRAM) memory with graphics processing logic and a high-speed graphics data interface. The µPD809400 is a system on chip (SoC) solution that can reduce material costs for mobile devices while enabling lower power consumption and convenient display panel configurations. Fabricated with 90-nm (nanometer: one billionth of a meter) process technology, it integrates large memory, timing control circuits as well as regulators and other analog circuits.
Features of the new chip include
(1) 8 megabits of 90-nm DRAM, enabling it to display 24-bit full color image data on VGA (640 x 480 pixels) panels;
(2) graphics processing logic for functions such as rotation and aspect ratio reversal, as well as function of expanding QVGA(320 x 240 pixels) data for display on VGA screens; and
(3) support for the high-speed Mobile CMADS(TM) 3000(Mobile Current Mode Advanced Differential Signaling, called "M-CMADS 3000" below) serial data interface, which requires only 6 transmitter lines instead of the 27 transmitter lines required by conventional parallel interfaces.
By reducing both power consumption and device part costs, while delivering high-resolution VGA graphics, the new product will help designers meet two of the most important goals in the competitive mobile market.
Various techniques are available to reduce component costs and power consumption in mobile devices. For example, in the current generation of mobile phones, the application processor accounts for a significant part of both cost and power consumption. With the trend toward higher resolution, the application processor must integrate more memory for graphics data, which increases the size and cost of the chip. The application processor also requires a continuous supply of power in order to transfer the data to the LCD panel. By inserting the new chip between the application processor and an LCD driver IC, designers can choose a less costly application processor and implement new power saving strategies, thus reducing the overall system cost and power consumption.
The main features of the new chip are as follows.
(1) Eight megabits of on-chip DRAM
DRAM can be fabricated with a cell size about 1/3 as large as that of SRAM. Compared to an SRAM memory macro fabricated with a same-generation process, an eDRAM macro occupies about only about 1/4 to 1/5 of the area when integrated into an application processor. This is why it was possible to provide eight megabits of on-chip DRAM in a package measuring only 5 x 5 mm. This is enough memory to display 24-bit full color VGA (640 x 480 pixels) on an LCD panel.
(2) Integrated graphics processing logic
Integrated graphics logic circuits provide functions such as image rotation and reversal of the horizontal/vertical aspect ratio. The chip is also capable of expanding QVGA data for display on VGA screens.
(3) M-CMADS 3000 display panel interface
The new chip supports the NEC Electronics M-CMADS 3000 a high-speed serial data transfer interface that reduces the number of transmitter lines while suppressing electromagnetic interference (EMI). When paired with a LCD driver IC such as the NEC Electronics µPD161842, it is an ideal solution for pivoting or sliding display designs, because it reduces the number of transmitter lines to only 6, compared to the 27 required by a conventional parallel interface. The low EMI noise makes it possible to eliminate parts such as transmitter line EMI filters, for lower part counts and more compact designs.
With its 8 megabits of eDRAM memory and integrated graphics logic, the new chip is an innovative solution from NEC Electronics, the industry leader in eDRAM technology. Since introducing its first unique eDRAM products for the 180-nm process, NEC Electronics has shipped more than 100 million eDRAM products, winning a high reputation for reliability and technological excellence. NEC Electronics intends to continue to expand its lineup of eDRAM products for mobile and other applications.
Pricing and availability
Samples of the new chip are available now. Volume production will start in August 2008, and is expected to reach 2 million units per month in 2009.
Please refer to the appendix for detailed specifications.
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