IC Test Adapter supports 0.8 mm pitch, 96-position BGA ICs.
February 22, 2011 -
Model PA-BGA96C-Z-01 probing and prototyping adapter for testing clock driver ICs includes GHz BGA socket. It features pin self-inductance of 0.11 nH and mutual inductance of 0.028 nH, while capacitance to ground is 0.028 pF and current capacity is 2 A/pin. Operating over temperature range of -35 to +100°C, unit is mounted on PCB which interfaces BGA socket to 0.100 in. center pin grid array on bottom side. It also has gold plated solder-tail machined pins for maximized reliability.
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|Original Press release |
Ironwood Electronics, Inc.
P.O. Box 21151
St. Paul, MN, 55121
Prototype and Debug 96 Ball BGA with Ease
Socket your 96 BGA PLL Clock Driver using Elastomer Socket with Superior Electrical Performance and Adapt to Standard Prototyping System
BURNSVILLE, MN - Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a newBGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor. The temperature range is -35°C to +100°C. The pin self inductance is 0.11 nH and mutual inductance of 0.028 nH. Capacitance to ground is 0.028 pF. Current capacity is 2 amps per pin. Works with most of 0.8mm pitch, 16x6 array Clock driver IC's.
The BGA socket is mounted on a PCB which interfaces the 96 position BGA socket to a 0.100" center pin grid array (PGA) on the bottom side. PA-BGA96C-Z-01 is constructed with gold plated solder-tail machined pins for maximum reliability. This allows the adapter for plug-in to a receptacle mounted on a prototype system as well as soldering directly. Optionally the adapters can be supplied with wire-wrap pins so the prototype can be built on a very inexpensive wire-wrap panels.
The BGA socket is also routed to 0.100" center test points on the top side of PCB for quick signal access during debug process. The specific configuration of the package to be tested in the PA-BGA96C-Z-01 is a BGA, 13.5x5.5mm, 0.8mm pitch, 96 position, 16x6 ball array. To use, place the BGA device into the socket base, lock the swivel socket lid assembly and turn the compression screw to apply pressure.
Pricing for the PA-BGA96C-Z-01 is $760 at qty 1 with reduced pricing available depending on quantity required.