IC Photocoupler offers high tolerance for noise.June 7, 2007 -
Housed in 4.4 x 3.6 x 2.5 mm MFSOP6 package, 20 MBd Model TLP2066 operates from 3.3 V with common mode transient immunity ratio of 15 kV/µsec and 3,750 Vrms isolation voltage. RoHS-compliant unit features operating temperature of -40 to +100°C, and addresses isolation requirements and switching noise elimination in switching power supplies, instrument I/O, computer peripheral interfaces, high-speed disk drive I/O, and microprocessor system interfaces.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Toshiba America Electronic Components (TAEC)
9775 Toledo Way
Irvine, CA, 92618-1811
USA
Toshiba Expands Optocoupler Lineup with Its First 3.3V, 20MBd IC Photocoupler
New Device Offers Lower Operating Voltage and Higher Tolerance for Noise
IRVINE, Calif., May 14 /-- Toshiba America Electronic Components, Inc., (TAEC)* today announced the company's first 3.3V, 20MegaBaud(1) (MBd) high speed IC photocoupler, the TLP2066, which addresses isolation requirements and switching noise elimination in switching power supplies, instrument I/O, computer peripheral interfaces, high speed disk drive I/O, microprocessor system interfaces, bus drivers for networking applications, and high speed logic systems.
"For demanding isolation requirements, the TLP2066 provides a compelling combination of high-speed switching, low propagation delay, high isolation voltage and high transient immunity," said Jeff Lo, business development manager, Optoelectronics, for TAEC. "In addition, the compact mini-flat SOP6 package and 3.3V supply voltage help differentiate this device from leading competitive solutions."
The new 3.3V device achieves a level of performance similar to the popular Toshiba 5V, 20MBd TLP116 IC photocoupler, at a lower operating voltage. In addition, it features a high tolerance for noise, with a common mode transient immunity ratio (CMR) of 15kV/microseconds, compared to the TLP116's CMR of 10kV/microseconds. See table below for key specifications and a comparison to the TLP116.
Technical Specifications
Specification TLP116 TLP2066
Package MFSOP6 MFSOP6
Operating Voltage (typ.) 5V 3.3V
Input Current Logic Low Output 5mA 5mA
Output Type Totem Pole Totem Pole
Output Current (max.) 10mA 10mA
Propagation Delay (max.) 60ns 60ns
Supply Current (max.) 5mA 5mA
Operating Temperature Range -40 degrees C to -40 degrees C to
+100 degrees C +100 degrees C
CMR (min.) +/-10kV/us +/-15kV/us
Isolation Voltage (min.) 3750Vrms 3750Vrms
The TLP2066 is offered in a compact 5-pin MFSOP6 package, measuring only 4.4mm x 3.6mm x 2.5mm, which is ideal for space constrained applications. The new optocoupler also features a wide operating temperature range of -40 degrees C to +100 degrees C, and is compatible with the Lead-Free(2) reflow solder process and RoHS-Compatible(3) requirements.
Pricing and Availability
Priced at $1.50/each, samples of the 3.3V, 20MBd TLP2066 are available now, joining existing 5V products in the Toshiba high-speed IC photocoupler family, which range in switching speed from 1MBd to 20MBd. Mass production is targeted to begin in July 2007.
*About TAEC
Combining quality and flexibility with design engineering expertise, TAEC brings a breadth of advanced, next-generation technologies to its customers. This broad offering includes memory and flash memory-based storage solutions, a broad range of discrete devices, displays, medical tubes, ASICs, custom SOCs, microprocessors, microcontrollers and wireless components for the computing, wireless, networking, automotive and digital consumer markets.
TAEC is an independent operating company owned by Toshiba America, Inc., a subsidiary of Toshiba Corp. (Toshiba), Japan's largest semiconductor manufacturer and the world's fourth largest semiconductor manufacturer. In more than 130 years of operation, Toshiba has recorded numerous firsts and made many valuable contributions to technology and society.
For additional company and product information, please visit TAEC's website at chips.toshiba.com. For technical inquiries, please e-mail Tech.Questions@taec.toshiba.com. http://www.toshiba.com/taec/news/press_releases/2007/opto_07_477.jsp
(1) For purposes of measuring data rate in this context, 1 MegaBaud (MBd) is an RS-232 logic-level compatible data rate that equals 1,000,000 bits per second or higher.
(2) Toshiba Semiconductor Company defines capitalized "Lead(Pb)-Free" products as those containing no more than 0.1 percent lead(Pb) by weight in Homogeneous Materials. This does not mean that Toshiba Semiconductor products labeled "Lead(Pb)-Free" are entirely free of lead(Pb).
(3) Toshiba Semiconductor Company defines "RoHS-Compatible" products as products that either (i) contain no more than a maximum concentration value of 0.1% by weight in Homogeneous Materials for lead, mercury, hexavalent chromium, polybrominated biphenyls (PBBs) and polybrominated diphenyl ethers (PBDEs) and of 0.01% by weight in Homogeneous Materials for cadmium; or (ii) fall within any of the application exemptions set forth in the Annex to the RoHS Directive(4).
(4) Toshiba Semiconductor Company defines "RoHS Directive" as the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment.
CONTACT: Poloi Lin of Toshiba America Electronic Components, Inc., +1-949-623-3098, poloi.lin@taec.toshiba.com
Web site: http://www.chips.toshiba.com/
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