Hub Dicing Blades suit chip scale package applications.
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Press Release Summary:
UniPlus blades are optimized for cut quality, blade life longevity, and productivity in various chip scale package (CSP) applications. Each blade is designed for specific package singulation application, including ceramic, BGA substrates, and QFN leadframes. Hard nickel bond permits optimized feed rates, and flexibility lets users tailor approach based on individual process and project requirements.
Original Press Release:
Kulicke & Soffa Introduces UniPlus Series of Hub Dicing Blades.
Fort Washington, PA-September 9, 2008 - Kulicke & Soffa Industries, Inc. (Nasdaq: KLIC) ("K&S") today announced the launch of UniPlus - a new series of hub dicing blades that provides improved cut quality, longer blade life and increased productivity for a variety of chip scale package (CSP) applications.
Each blade in the UniPlus series is designed for a specific package singulation application, including Ceramic, ball grid array (BGA) substrates and quad flat no-lead (QFN) leadframes. This flexibility allows customers to tailor their approach based on their individual process and project requirements and improves overall cut quality.
UniPlus blades also utilize a harder nickel bond, which maximizes blade life and permits higher feeding speeds than traditional bond materials.
UniPlus blades have a combination of superior dicing performance, durability and productivity and provide users with significant cost of ownership savings.
The UniPlus blades will be featured at the K&S booth at SEMI Taiwan, September 9 - 11, 2008, and are available from K&S sales representatives now.
About Kulicke & Soffa
Kulicke & Soffa (NASDAQ: KLIC) is the world's leading supplier of semiconductor assembly equipment, materials, and technology. K&S provides wire bonders, capillaries, wire, die bonders, and die collets for all types of semiconductor packages using wire as the internal electrical interconnections. K&S is the only major supplier to the semiconductor assembly industry that provides customers with semiconductor assembly equipment along with the complementing packaging materials and process technology that enable our customers to achieve the highest possible yields and throughput. The ability to provide these assembly related products is unique to Kulicke & Soffa, and allows us to develop system solutions to the new technology challenges inherent in assembling and packaging next-generation semiconductor devices. Kulicke & Soffa's web site address is www.kns.com.
