Hub Blades offer solution for dicing low-k wafers.
July 21, 2003 - Nova™ Hub Blades incorporate formulations of diamond concentration and nickel bond to reduce chipping and peeling common in low-k wafer dicing. High yields are achieved even while advancing wafers through process at standard production feed rates. Product offered in different formulations to address requirements of various low-k wafer materials.
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Original Press release
Kulicke & Soffa Industries, Inc.
2101 Blair Mill Rd.
Willow Grove, PA, 19090
USA
New Hub Blade from Kulicke & Soffa Offers an Immediate Solution for Dicing Low k wafers
K&S’ Nova™ Hub Blade Reduces Chipping/Peeling Common in Low-k Wafer Dicing
Willow Grove, PA (July 15, 2003) –Kulicke & Soffa Industries, Inc. (K&S) introduces a new hub blade that enables the dicing of various low-k wafers with high yield and good productivity, using current dicing equipment and practices. By incorporating specific formulations of diamond concentration and nickel bond, K&S’ Nova™ Hub Blades address the specific needs of various low-k wafers to minimize chipping and peeling during the dicing process. High yields are achieved even while advancing wafers through the process at standard production feed rates.
As product features shrink in size, IC manufacturers are transitioning to low dielectric constant materials in wafer fabrication for greater IC performance. While offering faster electrical signal speed and lower power consumption, these low-k dielectric materials impose new challenges in maintaining yield without compensating productivity. By maintaining cut quality at standard feed rates, the Nova Hub Blades enable the dicing of various low-k type wafers with high yield and good productivity.
K&S’ Semitec brand of Nova Hub Blades offer an immediate solution to the challenges imposed by low-k wafer dicing, without the need for significant investments in new capital equipment or new processes. With the Nova Hub Blades, customers can use current dicing equipment and familiar dicing practices.
“Without requirements for new technologies or intensive training, the Nova Hub Blades offer a quick, low-cost turnaround for IC manufacturers transitioning to low-k wafer dicing,” states Arnon Kalet, K&S Marketing Manager, K&S Hub Blades – SEMITEC.
K&S’ offers its Nova Hub Blades in different formulations to address the requirements of various low-k wafer materials.
Kulicke & Soffa is the world's largest supplier of wire bonding equipment in the semiconductor assembly market. K&S is the only company that develops and manufactures several of the key products that place physical demands on a semiconductor chip’s wire bonding pads. These include: test probes; bonding wire; capillaries; and wire bonding equipment, which provide an all-inclusive wire bonding process. In addition, we offer wafer dicing equipment and cutting blade solutions as well as Flip Chip wafer bumping services and technology. Chip scale and wafer level packaging solutions include Ultra CSP technology. Test interconnect products include standard and vertical probe cards, ATE interface assemblies and ATE boards for wafer testing, as well as test sockets and contactors for all types of packages.
Primary markets for K&S products and services include Asia, the U.S., Europe and Japan. Customers in these markets are firms that perform contract assembly of semiconductor devices, as well as merchant and captive manufacturers.
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