High-Throughput Metrology System utilizes TSV technology.
July 19, 2012 -
By allowing accurate measurement of critical TSV features such as side-wall angle, bottom diameter, and bottom curvature, Nova V2600(TM) helps accelerate development and improve production yield of multi-chip integrations that rely on TSVs (Through Silicon Vias). Process control solution delivers complete TSV dimensional metrology in production-ready system for industry's transition to 3D integration in production. Spectral method can be extended to future TSVs with diameters below 5 microns.
|Original Press release |
Nova Measuring Instruments Inc.
1270 Oakmead Parkway
Sunnyvale, CA, 94085
Nova Revolutionizes TSV Metrology with Innovative New System
Introducing Nova V2600(TM) with Dark-Field Reflectometry for Full TSV Profile Control
REHOVOT, Israel -- Novel technology brings the profiling power of Optical CD to TSV metrology; Enables the move to production of 3D integration with robust high-throughput control of TSV formation processes
Nova Measuring Instruments Ltd. (NASDAQ: NVMI), a leading provider of optical metrology solutions to the semiconductor process control market, today announced a technological breakthrough that will enable chipmakers to accelerate the development and improve production yield of multi-chip integrations that rely on TSVs (Through Silicon Vias). The powerful new Nova V2600 TSV Metrology system, developed in collaboration with leading device makers, allows for the first time accurate measurement of critical TSV features such as side-wall angle, bottom diameter, and bottom curvature. This much-awaited process control solution delivers complete TSV dimensional metrology in a high-throughput production-ready system for the industry's transition to 3D integration in production.
Several new technologies were developed by Nova for this complex application, breaking the barrier that previously precluded the use of Optical CD methodology on non-periodic structures. Using a special optical configuration (patent pending), Nova V2600 collects a dark-field reflectometry spectrum that is highly sensitive to variations in TSV internal structures. An innovative and unique modeling engine, proven to enable the translation of this spectrum into accurate via dimensions through spectral fitting, has been developed.
Unlike competing technologies that rely on resolution-limited optical imaging, this spectral method can be extended to future TSVs with diameters below 5 microns.
"We are excited to make our entry into the 3D integration market with a truly differentiated metrology product. It is very satisfying to introduce game-changing innovation into an emerging market segment that is looking for the right solution", said Gabi Seligsohn, President and CEO of Nova. "Customers response to the technology, performance, and productivity of the Nova V2600 has been outstanding, and we expect multiple orders from leading chipmakers to be finalized in the near future, following a rigorous selection process".
Nova V2600 fits into the production-proven Nova Modular Metrology[TM] platform that accommodates two metrology units on a single compact frame. This high-throughput platform is recognized for providing superior cost of ownership and operational flexibility. For more information please visit: http://www.nova.co.il.
About Nova: Nova Measuring Instruments Ltd. develops, produces and markets advanced integrated and stand alone metrology solutions for the semiconductor manufacturing industry. Nova is traded on the NASDAQ & TASE under the symbol NVMI. The Company's website is http://www.nova.co.il.
Dror David, Chief Financial Officer
Nova Measuring Instruments Ltd.
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