High Resolution Split Cameras suit PCB and wafer inspection.
November 23, 2011 -
Based on .22 in. CMOS sensor, 5 MP/30 FPS Split Camera provides 2,624 x 1,920 resolution with 1.67 x 1.67 µm pixel size, while 10 MP/15 FPS Split Camera, based on 0.434 in. CMOS sensor, features 3,664 x 2,736 resolution with 1.67 x 1.67 µm pixel size. Both offer Camera Link interface, global shutter, and M14 mount as well as 8 bits/pixel and 0.31 V/lux.s sensitivity. Cable length from sensor to process unit is 200 or 500 mm.
Original Press release
ISVI-Corp
290 Highland Ave. 2nd Floor
Cheshire, CT, 06410
USA
ISVI is Specialized in Cutting Edge Camera Technology
ISVI is specialized in cutting edge cameras technology for the High resolution Fast speed cameras for the Automation, high speed inspection, PCB and wafer inspection.
ISVI introduced the following Split cameras: 5 Mega Pixel / 30 FPS split camera 2,624(H) X 1,920(V) High Resolution 1.67um X1.67 um pixel size Sensor Size: .22", CMOS Senosr, Camera Link, Global shutter, 8 bits per pixel and .31V/lux.s Sensitivity. 10 Mega Pixel / 15 FPS Split camera 3,664(H) x 2,736(V) High Resolution 1.67um X1.67um pixel size Sensor size: 0.434", CMOS Senosr, Camera Link, Global shutter, 8 bits per pixel and 0.31V/lux.s Sensitivity.
Both cameras available with cable length from Sensor to process unit 200mm or 500mm. Both cameras use M14 mount type. We have the following lenses 13.4um / 18.2um.
Visit the web Page and download the PDF files from this link: www.isvi-corp.com
Contact Sales@ISVI-Corp.com and provide your application and requirements, and demonstration will be arranged for you.
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