High-Power Connectors suit backplane, midplane interfaces.
May 28, 2009 -
HCI® High Power series is designed to supply additional power at interface between daughter cards and backplanes or midplanes in chassis-based platforms. These standalone modules are rated for up to 75 A per contact, without exceeding 30°C temperature rise (no airflow). In addition to 1 x 2 and 1 x 3 power contact configurations, 2-position module is available with integrated guide between 2 power contacts. Series offers up to 261 A/in. linear power density.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
FCI
825 Old Trail Rd.
Etters, PA, 17319
USA
FCI Launches HCI® High Power Connectors for Backplane and Midplane Interfaces
ETTERS, PA. (May 12, 2009) - FCI, a leading developer of connectors and interconnect systems, announces the HCI® High Power backplane and midplane connector series to address customer demand for additional power at the interface between daughter cards and backplanes or midplanes in chassis-based platforms. These compact 2- and 3-position power modules utilize recently introduced HCI technology to enable increased linear power density along the daughter card edge. The HCI High Power backplane and midplane connectors are intended for host-to-card applications such as the blade, controller card or line card interfaces in servers, storage enclosures, networking or communications equipment.
"These stand-alone modules are designed for use alongside other hard metric (HM) backplane connector families such as FCI's high-performance AirMax VS® and ZipLine(TM) connector systems as well as Millipacs® 2mm HM connectors," said John Dodds, global power product marketing manager at FCI. "In fact, ZipLine and HCI High Power together offer the highest combination of signal and power density in the market."
HCI High Power modules extend beyond the capability of FCI's proven Hard Metric High Power connector system currently used in many production platforms. HCI High Power is rated for up to 75A per contact without exceeding a 30°C temperature rise (no airflow).
Individual power contacts are surrounded on four sides by molded housing walls resulting in an added safety feature that ensures adjacent power contacts cannot short together. In addition to conventional 1 x 2 and 1 x 3 power contact configurations, a 2-position module is available with an integrated guide between the two power contacts.
The series offers up to 261A/inch linear power density and is based on standard and costeffective stamped-and-formed power contact technology.
Typical pricing for the 2-position HCI High Power configuration is $6.50 per mated pair in prototype quantities.
For additional information about FCI's Power Solutions, please visit the dedicated microsite (www.fci.com/powersolutions) which contains information about its broad range of power interconnect solutions. For more information about HCI High Power Connectors, please visit www.fci.com/hcihighpower which features a selection tool that helps system designers select the HCI High Power Connector option that best fits their power distribution requirements.
For more information about the HCI High Power Connector series, contact FCI at 825 Old Trail Road, Etters, PA 17319-7883; call 800-237-2374, email at electronics.us@fciconnect.com or visit FCI on the web at www.fci.com/hcihighpower.
About FCI
With operations in 30 countries and sales of 1.25 billion euros in 2008, FCI is a leading manufacturer of connectors. Our 13,000 employees are committed to providing customers with high-quality, innovative products for a wide range of consumer and industrial applications. For more information: www.fci.com
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