Hi-Rel Connectors include EMI/RFI shielding.
January 20, 2011 -
Suited for I/O applications and PCB mount designs, Datamate S-Tek Connectors are available with single-piece, machined metal backshells that provide EMI/RFI shielding. Series includes 2 mm pitch cable-to-cable, cable-to-board, and board-to-board models rated for operation from -55 to +125°C. Contact design features stamped, 4-fingered, gold-plated beryllium copper clip, which resides in female half of connector, ensuring integrity of electrical connection, even under severe conditions.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Harwin, Inc.
1410 New Albany-Charlestown Pike, P.O. Box 319
New Albany, IN, 47151
USA
Datamate Hi-Rel Connector Range from Harwin Now Available with EMI/RFI Shielding
Established leading hi-rel connector family now suitable as I/O connector for first time
Salem NH, USA...Harwin Inc, the leading manufacturer of hi-rel connectors and SMT board hardware, has announced its Datamate hi-rel connector family is now available with single-piece, machined metal backshells that provide electrical screening against RFI and EMI interference. The launch of Datamate S-Tek now also enables the established high performance connector family to be utilized for I/O applications as well as PCB-mount designs.
Datamate is a 2mm pitch cable to cable, cable to board and board to board connector family designed to survive extremes of shock, vibration and temperature, yet it offers significant cost reductions, as price per contact is that of an industrial, commercial device. Datamate is proven on space, defense, medical and oil and gas exploration projects calling for very robust electronic systems where end equipment simply cannot fail. The interconnection system comes in a number of different families, including the mixed technology Datamate Mix-Tek which combines signal, power (up to 20A) and coax (up to 6GHz) contacts.
Datamate's patented contact design features a stamped, four-fingered, gold-plated beryllium copper clip with highly stressed contact beams. The clips reside in the female half of the connector clasping round pins tightly, ensuring the integrity of electrical connection even under severe conditions. This design ensures that Datamate connectors meet international standards and are rated for operation between -55 and +125degC with a vibration sensitivity of 10Hz to 2000Hz, 0.75mm, 98mm/s² (10g) for a duration of six hours. Bump severity is 390m/s² (40g), 4000± 10 bumps; shock severity is 981m/s² (100g) for 6ms, and acceleration severity is 490m/s² (50g). Mechanically, Datamate is guaranteed for 500 operations. Signal contacts are rated at up to 3A.
Manufactured in aluminium alloy and nickel plated for electrical performance and corrosion resistance, Datamate S-Tek backshells ensure full 360 degree electrical shielding when used in conjunction with the relevant J-Tek Datamate connectors and metal braid. Designed to attach to a wide variety of standard metallic braids using industry standard tools, the backshells enable the shield braid to be connected through the backshell to the PCB ground plane. Available in female cable-to-PCB-mount and female cable-to-panel-mount configurations in a range of sizes including 6,10,14,20 and 26 positions, the backshells also provide excellent design flexibility.
Further information from: www.harwin.com
About Harwin
Harwin is a manufacturer of standard & custom interconnect components with an enviable reputation for high quality and exceptional customer service. Harwin has been successfully manufacturing electronic components for more than 50 years. Harwin's sales and service extend worldwide via offices and manufacturing facilities in the USA, UK, Germany, Singapore & Taiwan and a world wide distribution network. Products include: High Reliability devices; RFI & PCB Hardware; and an extensive range of industry standard interconnection solutions. The company operates a continuous product development program.
|
|
|
|
|
|
|
| 
