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Hermetic Receptacle features aluminum compatible design.

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October 9, 2009 - Designed for 25-pin configuration, microComp Hermetic Receptacle provides insulation resistance of greater than 5,000 MW at 500 Vdc when tested in IAW MIL-STD 1344, Method 3003. Kryoflex® polycrystalline ceramic sealed unit has leak rate of less than 1 x 10-9 cc/sec helium at one atmospheric differential pressure. Operating from -55 to +170°C, receptacle is built with beryllium copper alloy contacts that are finished in nickel/gold.

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Original Press release

Pacific Aerospace & Electronic
434 Olds Station Rd.
Wenatchee, WA, 98801
USA



PA&E Announces Lightweight Hermetic Receptacle for Souriau's microComp® Connector Line


New Option for Applications Where Size, Weight and Hermetic Performance are Key Considerations

Wenatchee, WA - October 6, 2009 - Engineers who want to leverage Souriau's light-weight, high-density microComp connector line in harsh environment applications can now shave even more weight off their design without compromising hermetic integrity, following with the new aluminum compatible microComp hermetic receptacle from PA&E.

Souriau's microComp connector line is well suited to any application that requires a light-weight, high-density rectangular connector. microComp connectors typically weigh 60% less and are 25% smaller than standard high-density Sub-D connectors. They can be built with as few as seven or as many as 104 contacts and have a contact pitch of 2.0 x 1.7 mm2. The microComp line comes in both space and military grade configurations and each connector offers dismountable contact construction for wiring flexibility.

The new aluminum compatible PA&E microComp hermetic receptacle is currently designed for the microComp 25-pin configuration and offers a weight savings of up to 40% when compared to stainless steel alternatives. It has a leak rate of less than 1X10-9 cc/sec helium at one atmospheric differential pressure thanks to PA&E's Kryoflex® polycrystalline ceramic. Kryoflex-sealed connectors provide superior electrical performance -- up to 70 times the current-carrying capacity of conventional products -- while withstanding extreme mechanical and thermal stresses.

The microComp hermetic receptacle provides an insulation resistance of greater than 5,000 megohms at 500 VDC when tested in IAW MIL-STD 1344, Method 3003. It is built with beryllium copper alloy contacts that are finished in nickel/gold and has an operating temperature range of -55°C +170°C. The microComp receptacle is designed for aluminum, titanium or iron/nickel alloy applications and is available in laser-weldable or o-ring mount styles. These receptacle connectors are also available in a double-ended bulkhead configuration for applications requiring an interconnection on both sides.

PA&E, Inc. is an integrated manufacturing company, specializing in technically demanding ceramic and metal components and assemblies, hermetic connectors and advanced micro-electronic hermetic packaging for global leaders in the defense, space, medical and commercial industries. PA&E is ISO 9001:2000/AS9100 Rev B certified and NADCAP compliant.

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