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Heating/Cooling System handles 200 and 300 mm wafers.

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January 10, 2005 - Heating/Cooling Module is BOLTS compatible for integration with standard wafer handling automation. It uses resistive heating elements to achieve better than 450°C heating in less than 15 sec. After processing, module rapidly cools wafer to allow safe return to FOUP. Backside particle and metals contamination is minimized through low contact wafer chuck.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release

Owens Design, Inc.
47427 Fremont Blvd.
Fremont, CA, 94538
USA



Owens Design Introduces Wafer Heating/Cooling System


FOR IMMEDIATE RELEASE - Owens Design Inc., 47757 Fremont Boulevard, Fremont, CA 94538 www.owensdesign.com

CONTACT: Randy Curtis, Vice President of Sales & Marketing, Owens Design Inc. (510) 659-1800, rcurtis@owensdesign.com or Joanna Laznicka of Phaze-9 Corp. (408) 245-5117, joanna@phaze-9.com

FREMONT, CA - Owens Design Inc., a company providing capital equipment design and manufacturing services, announced today that it has introduced a wafer heating and cooling module to its family of custom wafer handling solutions. The heating and cooling module is designed for 200/300mm wafers and is BOLTS compatible for simple integration with standard wafer handling automation. The cost-effective module uses resistive heating elements to achieve better than 450°C heating in less than 15 seconds. After processing, the module rapidly cools the wafer to allow safe return to the FOUP. Backside particle and metals contamination is minimized through an innovative low contact wafer chuck. Test data demonstrates that the system provides excellent temperature uniformity and extremely low metals and backside contamination.

John Apgar, President of Owens Design stated, "Our customer challenged us to come up with a cost effective design while solving demanding thermal and cleanliness requirements. Our history of solving problems in custom wafer handling allowed us to come up with a novel solution. Packaging the system and its supporting electronics in a BOLTS compatible footprint makes integration to a standard EFEM simple and reduces our customer's development cost."

About Owens Design
Since 1982 Owens Design has been an innovative and reliable design and manufacturing partner for equipment companies in the semiconductor, data storage, biotech and related industries. As a turnkey source for design and manufacturing of complex capital equipment, Owens Design has served customers such as Ultratech, SCP Global, KLA-Tencor, Asyst Technologies, Aclara Biosciences, Lifescan, Teradyne, Credence, Mattson, and Novellus.

For more information please visit www.owensdesign.com
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