Gold Wire suits high-density packaging applications.
May 21, 2007 -
Designed for stacked-die and multi-tier applications, Formax(TM) bonding wire offers consistent loop profiles and promotes linearity and stability. It is capable of loop heights of less than 3 mil to over 16 mil, with wire span up to 320 mil using 1 mil dia wire. Intermetallic stability is based on proprietary 3N gold composition.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Kulicke & Soffa Industries, Inc.
2101 Blair Mill Rd.
Willow Grove, PA, 19090
USA
K&S Launches New Gold Wire Engineered for High-Density Packaging
Fort Washington, PA, April 25, 2007 - Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) announces a new gold wire, branded Formax(TM), which is designed for all types of stacked-die and multi-tier applications. This new bonding wire offers highly accurate and consistent loop profiles, providing higher wire bond yields. The Formax wire improves linearity and stability, while achieving higher molding results.
Jack Belani, senior vice president for K&S Packaged Materials and Corporate Marketing, stated," Our new Formax product is the next-generation in wire technology, which was developed from our proven and growing family of gold bonding wire." He continued, "Formax is the next engineering step from Radix and Radix Plus, offering higher strengths as well as lower heat and affected zone ranges."
Customer data has shown that Formax delivers higher, accurate and more consistent loop profiles in a wide range of complete packages with higher yields. Additionally, this wire has versatile looping capabilities, with loop heights of less than 3 mil to over 16 mil, with wire span up to 320 mil using a 1-mil wire diameter wire.
Klaus Dittmer, director of K&S Bonding Wire, added, "Our new Formax wire has extremely robust bondability for first and second bonds, giving our customers higher bond test results." The proven intermetallic stability of the Formax gold bonding is based on K&S' 3N gold composition.
About K&S
Kulicke & Soffa (NASDAQ: KLIC) is the world's leading supplier of semiconductor wire bonding assembly equipment. We believe K&S is the only major supplier to the semiconductor assembly industry that provides customers with assembly equipment along with the complementing packaging materials that contact the surface of the customer's semiconductor devices. The ability to provide these critical assembly related products is unique to Kulicke & Soffa and allows us to develop system solutions to the new technology challenges inherent in assembling and packaging next-generation semiconductor devices. Kulicke & Soffa's web site address is http://www.kns.com.
|
|
|
|
|
|
|
| 
