Finite Element Analysis Solver Software provides sheet metal forming simulations.May 14, 2010 -
Utilizing multiple-core computing platform from Intel, INC Solver is compatible with Microsoft Windows platform, using SMP scheme and multiple-core CPUs. Program supports non-conforming CAD surfaces, which eliminates need for mesh repair, and utilizes simultaneous fusion-fission approach to handle mesh adaptivity. For die face design virtual tryout, solver can simulate gravity-loading, binder-wrap, crash-form, single-action and double-action draw die, as well as spring back prediction and lancing.
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Original Press release
Eta, Inc
1133 E. Maple Rd Ste 200
Troy, MI, 48083
USA
ETA Introduces INC Solver for Sheet Metal Forming Simulations
Virtual tryout tool for die face design
Engineering Technology Associates, Inc. (ETA) announces the introduction of the INC Solver, an explicit finite element analysis (FEA) solver designed for sheet metal forming simulations. This virtual tryout tool for die face design expands the usability of ETA's latest edition of DYNAFORM's Die Face Engineering (DFE) module, version 5.7.3, which was released this March. INC Solver provides a value solution for customers who are looking for an easy-to-master rapid die design and virtual tryout tool that generates quick results without sacrificing accuracy.
Utilizing the latest multiple-core computing platform from Intel, INC Solver is compatible with the Microsoft Windows platform, using a Shared Memory Processing (SMP) scheme and multiple-core CPUs.
Simulation setup is quick and efficient, yet robust, with fine-tuned parameters for optimal results. INC Solver supports non-conforming CAD surfaces, which eliminates the need for mesh repair, and utilizes a simultaneous fusion-fission approach to handle mesh adaptivity. For die face design virtual tryout, the solver offers capabilities for simulating gravity-loading, binder-wrap, crash-form, single-action and double-action draw die, as well as spring back prediction and lancing operations.
INC Solver takes advantage of Intel's latest multiple-core computing platform to make computing very affordable. For example, a 4-Core system costing under $1,500 can process the most complicated large bodyside panel simulation in less than 50 minutes.
In addition to DFE, DYNAFORM consists of three other modules including Blank Size Engineering (BSE), LS-DYNA-based Formability Simulation (FS) and LS-DYNA-based Die System Analysis (DSA). DYNAFORM is a complete die system simulation solution which allows organizations to bypass soft tooling, reducing overall user qualification thresholds and tryout time, lowering costs, increasing cycle times and productivity, and providing confidence in die system design.
About Engineering Technology Associates, Inc. (ETA)
Engineering Technology Associates, Inc. (ETA) was established in 1983 by advanced product development engineers working as structural analysts for the world's largest automotive manufacturers. ETA's expertise in the areas of vehicle durability, NVH, metal forming, crashworthiness, occupant safety and product design have provided an intimate knowledge of the challenges and needs of the product development engineer. Proactive in the creation and implementation of new analysis methods and software, ETA is the developer of the Inventium Suite, DYNAFORM and VPG. ETA is a subsidiary of Cranes Software International Limited (CSIL).
For further information about ETA and its products, please visit to http://eta.com or call (248) 729-3010.
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