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Fanless Embedded Computer extends IoT to harsh environments.

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May 12, 2014 - Designed around VIA EPIA-P910 Pico-ITX board, VIA AMOS-3003 features 1.2 GHz VIA Nano® X2 E-Series dual core processor and VIA VX11H media system processor. Fanless 64-bit unit offers dual Gigabit Ethernet and optional WiFi, GPS, and 3G networking with Dual SIM card support. Providing up to 8 GB of DDR3-1333 memory, system utilizes mSATA module or standard 2.5 in. SATA HDD/SSD drive for storage. Applications include M2M controllers and data collection terminals for in-vehicle control.

VIA Extends the Internet of Things to Harsh Environments with the New VIA AMOS-3003 Fanless System


VIA Technologies, Inc.
8F, 533, Chung-Cheng Rd.
Taipei, Taiwan



Press release date: April 29, 2014

Compact ruggedized design with rich network connectivity including dual Gigabit Ethernet, WiFi, GPS and dual SIM card support for 3G networking

Taipei, Taiwan — VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-3003, a compact embedded IoT system designed around the tiny VIA EPIA-P910 Pico-ITX board. Combining low power, rich connectivity and high performance 64-bit computing in a ruggedized design, the VIA AMOS-3003 delivers all the latest features and digital media standards required in data collection terminals for in-vehicle control as well as machine to machine controllers in a host of industrial automation applications.

Leveraging the advanced capabilities of the combined 1.2GHz VIA Nano® X2 E-Series dual core processor and VIA VX11H media system processor (MSP), the VIA AMOS-3003 features rich connectivity including dual Gigabit Ethernet and optional WiFi, GPS and 3G networking with Dual SIM card support. With a host of extendable I/O options to connect peripheral devices as well as Wake On LAN (WOL) and pre-boot execution environment (PXE) support, the VIA AMOS-3003 is the ideal solution for customers to create a host of remotely managed IoT devices for almost any environment.

“The proliferation of wireless connectivity to the cloud is opening up exciting new possibilities for capturing more real-time IoT data in order to improve operating efficiency,’ said Epan Wu, Head of VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA AMOS-3003 provides a robust system with wide power input support and flexible connectivity options to enhance the remote collection and processing of this data in the most demanding environments.”

Software solutions packs are available the VIA AMOS-3003 include Microsoft Win7, Win8, and WES7 as well as Linux OS. Customers can also take advantage of VIA’s industry leading hardware and software support, including our SMART ETK (Embedded Tool Kit) to create customized designs with a quick time to market.

VIA AMOS-3003
Leveraging the low power consumption and digital excellence of the VIA EPIA-P910 Pico-ITX board, featuring a 1.2GHz VIA Nano X2 E-Series dual core processor and VIA VX11H MSP, the AMOS-3003 combines rugged design with rich network connectivity including dual Gigabit Ethernet (GLAN), and optional Wi-Fi, GPS, and 3G networking. Storage is provided through support for an mSATA module or a standard 2.5" SATA HDD/SSD drive while the system supports up to 8GB of DDR3-1333 memory.

Comprehensive I/O functions on front, left side, and rear panels make the AMOS-3003 a flexible solution for a wide range of embedded applications. Rear I/O includes, 1 HDMI port, 1 VGA port, 2 USB 3.0 ports, 2 USB 2.0 ports, 2 GLAN ports, Line-in/out/mic-in, as well as power button and the power input connector. Left side I/O includes 3 COM ports and 1 9-pin D-Sub connector for 8-bit GPIO while front panel I/O includes 4 antenna holes. On board I/O includes 1 mSATA connector, 1 SATA connector, 2 SIM slots and 2 Mini-PCIe slots for further expansion options.

For more information about the VIA AMOS-3003, please visit: http://www.viaembedded.com/en/products/systems/2210/1/AMOS-3003_(Pico-ITX).html

About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. www.via.com.tw

VIA PR Contact
International:
Richard Brown
Phone: (886)-2-2218-5452 #6201
Fax: (886)-2-8218-6752
Email: RIBrown@via.com.tw
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