Failure Analysis System inspects IC chip packages.
February 12, 2009 -
Using laser technology, FiberTower(TM) DFAS allows operator to remove individual layers of mold compound through to substrate. System can import images from variety of testing processes such as SAM, X-ray, and SEM to show operator exact area of concern within sample. Controllable by operator through GUI, DFAS IC chip decapitation process provides accurate dissection without damaging sample. Laser spectrometry option offers detailed report of all materials as they are processed.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Fonon Display & Semiconductor Systems
41 Skyline Dr., Suite 1009
Lake Mary, FL, 32746
USA
Fonon DSS Announces the FiberTower(TM) DFAS IC Chip Package Failure Analysis System
Lake Mary, Fl., February 3, 2009 - Fonon DSS (Display & Semiconductor Systems), the cutting edge developer of state-of-the-art, laser scribing, dicing, marking, coating removal, direct patterning, and photo mask repair solutions to the Flat Panel Display (FPD), Semiconductor, Photovoltaic and Electronics industries throughout the world announced today the release of the FiberTower(TM) DFAS IC chip package failure analysis system.
The FiberTower(TM) DFAS uses laser technology to allow an operator to remove individual layers of the mold compound all the way through to the substrate. The DFAS operator can chose to remove the entire compound, individual layers, or sections of the mold compound ranging from the entire sample to just one wire due to the precision of the laser spot positioning. The FiberTower(TM) DFAS can import images from a variety of testing processes such as SAM, X-Ray, and SEM to show the operator exactly the area of concern within the sample.
Most failure analysis labs use time consuming chemical and mechanical etching processes on a routine basis to dissect chips to see why they failed. Unlike the uncontrollable, wet, chemical etch process, the DFAS IC chip decapitation process is 100% controllable by the operator through a Graphic User Interface (GUI). Utilizing the laser equipped DFAS, the operator can select a specific area to examine instead of dissecting the whole chip as chemical and mechanical etchers must do.
Traditionally, diamond saws were used for processes commonly used in failure analysis. This process is very slow requiring a significant amount of time for additional polishing due to the large standoff required from the cut, and still does not guarantee that the sample will not be damaged. The DFAS utilizes a Fonon's laser wafer scribing/cutting process to provide an extremely accurate dissection without damaging the sample.
The FiberTower(TM) DFAS also offers a laser spectrometry option to provide a detailed report of all the materials as they are being processed. This feature allows the operator to find inconsistencies within the compound, flow settlement, and contaminants, and provides detail report of the exact characteristics of the mold compound.
Eliminating the majority of cost, sample damage, as well as long term health hazards associated with the use of chemicals, the DFAS performs chip failure analysis with unmatched safety, savings, accuracy and speed.
About Fonon DSS: A division of Fonon Technology International, the world renowned inventor and manufacturer of Zero Width Laser Cutting Technology(TM), Fonon DSS focuses on the semiconductor and flat panel display industries utilizing the patented Zero Width Laser Cutting Technology(TM) (ZWLCT(TM)) to create products with the highest level of precision. Fonon DSS provides state-of-the-art laser scribing, laser dicing and fiber laser marking solutions to customers in the Flat Panel Display (FPD), Semiconductor and Electronics industries throughout the world. For more information, visit http://www.fonondss.com or call 407-829-2613.
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