FIB/SEM Systems support TEM sample preparation.
August 31, 2012 -
Respectively accommodating up to 100 mm samples and full 300 mm wafers, Helios NanoLab(TM) 450HP and 1200HP DualBeam(TM) systems meet requirements for semiconductor process development at 28 nm device geometry node and below. Systems can prepare 15 nm thick samples with less than 2 nm damage layer in 90 min. QuickFlip grid holders facilitate inverted sample preparation, and iFast(TM) automation software optimizes usability while ensuring consistency among multiple operators and systems.
FEI Launches New Helios NanoLab HP Platform for High Productivity TEM Sample Preparation
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
5350 NE Dawson Creek Dr.
Hillsboro, OR, 97124
Press release date: August 28, 2012
New DualBeam systems enable expedited process development, helping chipmakers improve yield ramp by making vital process improvement decisions faster.
Hillsboro, Ore. - FEI (NASDAQ: FEIC), a leading instrumentation company providing imaging and analysis systems for research and industry, today announced new Helios NanoLab(TM) DualBeam(TM) systems for engineers that need to make vital process improvement decisions. The 450HP and 1200HP DualBeam systems include new capability that meets the critical requirements for semiconductor process development at the 28nm device geometry node and below.
"Developing new processes and technologies that include shrinking geometries, new materials and novel device architectures and ramping those processes to high-volume production quickly are driving unprecedented increases in the demand for TEM analysis," stated Rudy Kellner, vice president and general manager, Electronics Business Unit, FEI. "TEM samples must be ultra-thin, of the highest quality, and generated in a routine and consistent manner across a fleet of tools. Typically, as samples get thinner, the difficulty becomes time to results, operator skill level and subtle differences among equipment. We have designed the 450HP and 1200HP systems to overcome these issues. Ultimately, the system's ability to yield more good samples at double the throughput allows for potentially significant reductions for both the time-to-answer and the cost-per-answer."
The Helios NanoLab 450HP and 1200HP DualBeam systems can prepare 15nm thick samples with less than a 2nm damage layer in 90 minutes, two times faster than competitive alternatives. iFast(TM) automation software maximizes ease-of-use while ensuring consistency among multiple operators and systems. QuickFlip grid holders facilitate inverted sample preparation to improve sample quality while maintaining high throughput. Cell Navigation software allows automated navigation within non-unique memory arrays that can locate a single designated bit cell in a 50nm lateral field. Together, these features enable a robust process to prepare high quality, ultra-thin lamella across multiple tools in a consistent manner-independent of operator skill level.
The Helios NanoLab 450HP and 1200HP DualBeam systems are available for ordering immediately. The 450HP model can accommodate samples up to 100mm, while the 1200HP system can handle full 300mm wafers. For more information, please visit: www.FEI.com/TemPrep .
About FEI FEI (Nasdaq: FEIC) is a leading diversified scientific instruments company. It is a premier provider of electron- and ion-beam microscopes and solutions for nanoscale applications across many industries: industrial and academic materials research, life sciences, semiconductors, data storage, natural resources and more. With more than 60 years of technological innovation and leadership, FEI has set the performance standard in transmission electron microscopes (TEM), scanning electron microscopes (SEM) and DualBeams(TM), which combine a SEM with a focused ion beam (FIB). Headquartered in Hillsboro, Ore., USA, FEI has over 2,300 employees and sales and service operations in more than 50 countries around the world. More information can be found at: www.fei.com.