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Epoxy Potting Compound suits applications up to 365°F.

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Epoxy Potting Compound suits applications up to 365°F.
Epoxy Potting Compound suits applications up to 365°F.

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May 3, 2011 - Intended for potting and encapsulating in electrical and electronic applications, Aremco-Bond(TM) 2315 provides flexural strength of 12,300 psi, volume resistivity of 1.0 x 1015, and dielectric strength of 480 V/mil. Black-pigmented, thermally conductive product offers resistance to acids, alkalis, organic fluids, and salts. Featuring mixed ratio of 100 parts resin to 25 parts hardener by weight, Aremco-Bond 2315 cures in 2 hours at 160°F plus 2 hours at 300°F.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release

Aremco Products, Inc.
707 Executive Blvd., Unit
Valley Cottage, NY, 10989
USA



Aremco-Bond 2315 High Temp Potting Compound Now Available


Valley Cottage, NY -

SUMMARY
Aremco-Bond(TM) 2315, a new high temperature, thermally conductive, epoxy-potting compound
produced by Aremco Products, Inc., is now available for electrical and electronic potting applications to 365°F (185°C).

FEATURES
Aremco-Bond(TM) 2315 is a low viscosity, black-pigmented, high temperature, epoxy compound used in electrical and electronic applications to 365°F (185°C). Additional features include high thermal conductivity, good electrical insulation, and low shrinkage after cure.

Aremco-Bond(TM) 2315 provides high flexural strength of 12,300 psi. Electrical properties include a volume resistivity of 1.0 x 1015, dielectric strength of 480 volts/mil, and dielectric constant of 4.7 at 1 kHz. Exceptional chemical resistance to acids, alkalis, organic fluids, and salts, is also provided.

Aremco-Bond(TM) 2315 is a 100% solids epoxy that is mixed in a ratio of 100 parts resin to 25 parts hardener by weight. Mixed viscosity is 3,000 cps and the pot life for a 100 gram mass is greater than 8 hours at room temperature. Recommended cure is 2 hours at 160°F plus 2 hours at 300°F.

Alternative cure is 6 hours at 250°F. Cured product is exhibits a linear shrinkage of .003 in/in and Shore-D hardness of 92.

Aremco-Bond(TM) 2315 is useful for potting and encapsulating densely packaged power supplies, rectifiers, integrated circuits, thick film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers, and semiconductors.
Aremco-Bond tm 2315 is supplied in easy to mix pint, quart and gallon kits.

Please contact Aremco's Technical Sales Department for more information about this advanced product.
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