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Epoxy Compound serves potting applications from -67 to 365F.

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Epoxy Compound serves potting applications from -67 to 365F.
Epoxy Compound serves potting applications from -67 to 365F.

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June 5, 2012 - Available for electrical and electronic potting applications, thermally conductive Aremco-Bond(TM) 2318 is medium-viscosity (16,000 cP mixed), black-pigmented epoxy compound with 12,300 psi flexural strength and 1,135 psi tensile-shear strength. Other properties include volume resistivity of 3.0 x 1015, dielectric strength of 460 V/mil, and dielectric constant of 4.8 at 1 kHz. Recommended cure schedule is 4 hr at room temperature plus 2 hr at 200F.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press Release

Aremco Products, Inc.
707 Executive Blvd., Unit
Valley Cottage, NY, 10989

Aremco-Bond 2318 High Temp Potting Compound Now Available

Valley Cottage, NY -

Aremco-Bond(TM) 2318, a new high temperature, thermally conductive, epoxy-potting compound produced by Aremco Products, Inc., is now available for electrical and electronic potting applications from -55 to +185 C (-67 to 365 F).

Aremco-Bond(TM) 2318 is a medium viscosity, black-pigmented, high temperature epoxy compound used in electrical and electronic applications from -55 to +185 C (-67 to 365 F). Aremco-Bond(TM) 2318 provides high flexural strength of 12,300 psi, tensile-shear strength of 1,135 psi, volume resistivity of 3.0 x 1015, dielectric strength of 460 volts/mil, and dielectric constant of 4.8 at 1 kHz. Exceptional chemical resistance to acids, alkalis, organic fluids, and salts, is also provided.

Aremco-Bond(TM) 2318 is a 100% solids epoxy that is mixed in a ratio of 100 parts resin to 12 parts hardener by weight. Mixed viscosity is 16,000 cP and the pot life for a 100 gram mass is 2 hours at room temperature. Recommended cure is 4 hours at room temperature plus 2 hours at 200 oF. An alternative cure schedule is 24 hours at room temperature. Cured product exhibits a linear shrinkage of .003 in/in and a Shore-D hardness of 89.

Aremco-Bond(TM) 2318 is useful for potting and encapsulating densely packaged power supplies, rectifiers, integrated circuits, thick film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers, semiconductors, and electrical feed-thru bushings.

Aremco-Bond(TM) 2318 is supplied in easy to mix pint, quart and gallon kits. Please contact Aremco's Technical Sales Department for more information about this advanced product.
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