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Epoxy Compound serves potting applications from -67 to 365F.

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Epoxy Compound serves potting applications from -67 to 365F.
Epoxy Compound serves potting applications from -67 to 365F.
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June 5, 2012 - Available for electrical and electronic potting applications, thermally conductive Aremco-Bond(TM) 2318 is medium-viscosity (16,000 cP mixed), black-pigmented epoxy compound with 12,300 psi flexural strength and 1,135 psi tensile-shear strength. Other properties include volume resistivity of 3.0 x 1015, dielectric strength of 460 V/mil, and dielectric constant of 4.8 at 1 kHz. Recommended cure schedule is 4 hr at room temperature plus 2 hr at 200F.

Aremco-Bond 2318 High Temp Potting Compound Now Available

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

Aremco Products, Inc.
707 Executive Blvd., Unit
Valley Cottage, NY, 10989

Press release date: June 1, 2012

Valley Cottage, NY -

SUMMARY Aremco-Bond(TM) 2318, a new high temperature, thermally conductive, epoxy-potting compound produced by Aremco Products, Inc., is now available for electrical and electronic potting applications from -55 to +185 C (-67 to 365 F).

FEATURES Aremco-Bond(TM) 2318 is a medium viscosity, black-pigmented, high temperature epoxy compound used in electrical and electronic applications from -55 to +185 C (-67 to 365 F). Aremco-Bond(TM) 2318 provides high flexural strength of 12,300 psi, tensile-shear strength of 1,135 psi, volume resistivity of 3.0 x 1015, dielectric strength of 460 volts/mil, and dielectric constant of 4.8 at 1 kHz. Exceptional chemical resistance to acids, alkalis, organic fluids, and salts, is also provided.

Aremco-Bond(TM) 2318 is a 100% solids epoxy that is mixed in a ratio of 100 parts resin to 12 parts hardener by weight. Mixed viscosity is 16,000 cP and the pot life for a 100 gram mass is 2 hours at room temperature. Recommended cure is 4 hours at room temperature plus 2 hours at 200 oF. An alternative cure schedule is 24 hours at room temperature. Cured product exhibits a linear shrinkage of .003 in/in and a Shore-D hardness of 89.

Aremco-Bond(TM) 2318 is useful for potting and encapsulating densely packaged power supplies, rectifiers, integrated circuits, thick film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers, semiconductors, and electrical feed-thru bushings.

Aremco-Bond(TM) 2318 is supplied in easy to mix pint, quart and gallon kits. Please contact Aremco's Technical Sales Department for more information about this advanced product.
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