Electronic Enclosures offer recessed subrack for EMC protection.
January 14, 2013 -
Available in 7U and 9U versions, which accommodate 6U pluggable boards, Recessed Enclosure Series allows subrack and boards to be completely protected inside enclosure frame, preventing damage to modules, limiting exposure to dust, and minimizing susceptibility to EMI/RFI. Versions for 3U pluggable boards in 4U overall height are also available. Front-to-rear or bottom-to-top cooling options are standard in 7U to 9U sizes, and wide range of AC or DC power supplies are available.
|Original Press release |
101 Randall Drive
Waterloo, ON, N2V 1C5
Pixus Technologies Offers New Recessed Chassis Options for EMC
Waterloo, Ontario — Pixus Technologies, a supplier of backplane, chassis, and embedded component solutions, now offers enclosures with the subrack recessed within the enclosure frame for additional protection, including EMC considerations.
Pixus’ new enclosure option can be recessed in various depths according to the customer’s requirements. The design allows the subrack and boards to be completely protected inside the enclosure frame, preventing damage to the modules, limiting exposure to dust, and reducing the susceptibility of EMI/RFI. An optional side or bottom-hinged door allows the case to be fully enclosed or even locked.
The first in the recessed series are 7U and 9U versions, which accommodate 6U pluggable boards (with 1U-3U of space for various fan/airflow configurations). Versions for 3U pluggable boards in a 4U overall height are also available. Backplanes are available in OpenVPX, CompactPCI/2.16, PCIe Gen2 or Gen3, VME64x, VXS or custom. Utilizing a modular construction, the sizes and options available are highly versatile. In many applications, engineers will utilize a portion of the subrack area for the embedded computer boards and the other section for their specialized devices. Provisions for mounting of custom devices are easily implemented in the modular enclosure.
Cooling options for the recessed enclosure series are dependent on the application requirements. Front-to-rear or bottom-to-top cooling options are standard in the 7U to 9U sizes. A wide range of AC or DC power supplies are available. System monitoring and management is also an option.
About Pixus Technologies
Leveraging over 20 years of innovative standard products, the Pixus team is comprised of industry experts in electronics packaging. Founded in 2009 by senior management from Kaparel Corporation, a Rittal company, Pixus Technologies' embedded backplanes and systems are focused primarily on ATCA, OpenVPX, PCIe and custom designs. Pixus also has an extensive library of VME-based and cPCI-based solutions. In May 2011, Pixus Technologies became the exclusive North and South American supplier of the electronic packaging products previously offered by Kaparel Corporation and Rittal.
Pixus Technologies is actively involved in the continuous development of leading AdvancedTCA, OpenVPX, and cPCI/PCIe products that will surpass all data transfer and cooling challenges.