Electrically Conductive Adhesive supports RFID applications.
July 3, 2012 -
Designed to bond tiny chips to defined positions on RFID antenna, DELOMONOPOX AD268 adheres to variety of flexible and rigid substrates, including PET, polyimide, FR4, copper, aluminum, and silver. Anisotropic epoxy resin cures in 6 seconds at 190°C with thermode, enabling up to 20,000 microchips to be bonded per hour on flip-chip production system.
|Original Press release |
DELO Industrial Adhesives
DELO Enables Short Processes
WINDACH, Germany, --
- New adhesive for RFID applications
The worldwide RFID market is gaining ground. IDTechEx forecasts that the industry will grow by 2.4 to a total of 125 billion RFID tags by 2020*. Manufacturers of RFID labels focus on reasonably priced production. At the same time, the tag chip must be fixed in a reliable way. The new DELOMONOPOX AD268 epoxy resin copes with these requirements. It enables extremely fast production processes and the utmost reliability. This anisotropic electrically conductive adhesive is designed for tasks in the RFID industry. However, it can also be used in other electronic packaging applications.
"Our adhesive has an improved resistance to humidity", explains Jens Amarell, Product Manager RFID at DELO Industrial Adhesives. "This makes it the ideal solution to applications where reliability is important, such for example in railway tickets, passports or protection of high-quality products against plagiarism." DELOMONOPOX AC268 is used in chip attach processes, especially in flip-chip applications. It reliably bonds tiny chips, which partly measure only 400 microm, to defined positions on the RFID antenna. DELO could prove the continuously good electrical conductivity to customers' substrates with the help of storage test at 85 degree(s)C / 85 % r. h.
Thanks to the short curing time of six seconds at 190 degree(s)C with a thermode, fast production processes are possible. Therefore, up to 20,000 microchips can be bonded per hour on a flip-chip production system. The adhesive adheres well to a wide variety of flexible and rigid substrates including PET, polyimide, FR4, copper, aluminum and silver.
DELOMONOPOX AC268 was thoroughly tested in DELO's engineering labs. The tests included temperature shock tests, bending tests and storage in a climatic chamber. With its lab equipment and knowledge as global market leader in smart label adhesives, DELO provides its customers with comprehensive support from the concept phase up to series production.
Further details can be found at http://www.delo.de/RFID
*Source: IDTechEx: The global market for RFID 2010-2020. http://www.idtechex.com
DELOŽ is a leading manufacturer of industrial adhesives. In the fiscal year 2011/12 300 employees generated sales revenues of US$ 58 million. The company supplies tailor-made special adhesives and complementary equipment for applications in special lines of business - from electronics to the chip card and automotive industry, as well as in glass and plastic design. DELOŽ's customers include Bosch, Daimler, Festo, Infineon, Knowles and Siemens. DELOŽ has a network of worldwide distributors and sales partners.
Ms. Jennifer Bader
DELO Industrial Adhesives
DELO-Allee 1, 86949 Windach, Germany