Electric Power Module meets needs of hybrid, electric vehicles.
June 6, 2011 -
J-Series transfer molded power module (T-PM), CT300DJH060, is primarily intended for hybrid and electric vehicle applications. This 600 V/300 A power module incorporates 2 Carrier-Stored Trench Gate Bipolar Transistor (CSTBT(TM)) IGBT chips and utilizes direct lead bonding technology for optimal reliability. Built to be completely Pb free, including terminal plating, design also offers optimized power and temperature cycle lifespans.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
|Original Press release |
173 Pavilion Lane
Youngwood, PA, 15697
Mitsubishi Electric Power Module for Hybrid and Electric Vehicles Is Now Available in the Americas from Powerex, Inc.
Product Description -
Mitsubishi Electric Corporation recently launched a new transfer molded power module (T-PM) designed predominantly for hybrid and electric vehicle applications. The J-Series T-PM, incorporating Mitsubishi Electric's proprietary technology which ensures power loss reduction, boasts a lifespan 30 times longer than industrial power modules and is also completely lead (Pb) free, including the terminal plating.
In the Americas, this new transfer molded power module is now available exclusively through Powerex, Inc. With its corporate headquarters located in Youngwood, Pennsylvania, southeast of the City of Pittsburgh, Powerex is the sales and logistics arm for Mitsubishi Electric Power Devices in the Americas.
Product Ratings and Characteristics -
Two Carrier-Stored Trench Gate Bipolar Transistor (CSTBT(TM)) IGBT chips are incorporated in a 600V/300A power module.
The J-Series T-PM (CT300DJH060) offers enhanced reliability by utilizing direct lead bonding (DLB), a technology developed by Mitsubishi Electric. DLB reduces power loss through decreasing wiring resistance and inductance in modules through the use of an extended main terminal made long enough to be bonded directly to the power chip. Previously, power chips were connected to the terminals by aluminum wire.
As referenced previously, the J-Series T-PM's power cycle and temperature cycle lifespans are 30 times longer than those of typical industrial power modules. The power cycle lifespan is based on repetitive operation tests with the chip energized, rapidly changing the temperature within a range of 50-100 degrees C. The temperature cycle lifespan is based on repetitive operation tests, modulating the temperature between -40 degrees C and 125 degrees C without the chip energized.
In the expanding hybrid and electric vehicle market, automotive components are required to meet stringent safety standards, requiring power modules to be much more reliable than the standards required for industrial applications.
Through its advanced technology, Mitsubishi Electric has achieved the quality and lifespan required for automotive applications. In 2004, through the use of transfer molding technology, Mitsubishi Electric was the first company to offer a highly reliable, lead (Pb)-free power module for automotive applications. With transfer molding--a process that enables the manufacturer to make multiple molds simultaneously, rendering power modules highly reliable--heated and pressurized resin is poured into a metal mold and then enclosed.
The traceability system for the J-Series T-PM enables management of material and components as well as the entire production process for each unit.
These products are available from stock to 12 weeks at $300 per device.
For more information, contact Paul Hatala: firstname.lastname@example.org (724) 925-4341.