Elastomer Thermal Gap Filler requires no adhesive.September 24, 2010 -
Available in 0.020-0.200 in. thicknesses in 0.010 in. increments, Tflex(TM) XS400 Series RoHS-compliant thermal pad provides moderate thermal performance with thermal conductivity of 2.0 W/mK. Soft interface pad conforms with minimal pressure, and its design minimizes thermal resistance as well as mating part stress. Due to TG (Tgard(TM)) liner, it is electrically insulating, stable from -40 to +160°C, and certified to UL 94V0 flammability rating.
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Original Press release
Laird Technologies
16401 Swingley Ridge Rd., Suite 600
Chesterfield, MO, 63017
USA
Laird Technologies Releases New Tflex(TM) XS400 Series Thermal Gap Filler
Compliant Elastomer Gap Filler Provides Electrical Isolation with High Tolerance Stack-Up
St. Louis, Missouri, USA - Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the release of its new Tflex(TM) XS400 Series thermal gap filler.
The Tflex(TM) XS400 Series is the latest thermal pad in the Tflex(TM) thermal gap filler line, offering a compliant elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.0 W/mK. This soft interface pad conforms with minimal pressure, resulting in minimal thermal resistance even at low pressure with little or no stress on mating parts.
Available in thicknesses from 0.020 inch (0.50 mm) through 0.200 inch (5.0 mm) in 0.010 inch increments, the Tflex(TM) XS400 thermal material is naturally tacky for easy assembly and no adhesive coating is required. Due to its TG (Tgard(TM)) liner on the other side, it is electrically insulating, stable from -40°C to 160°C, and is certified to UL 94V0 flammability rating; complying with the limits of RoHS Directive 2002/95/EC and its subsequent amendments.
"The Tflex(TM) XS400 gap filler is an easy-to-handle thermal pad that possesses low outgassing properties," said Jane Bell, Laird Technologies Thermal Interface Materials Product Manager. "It is an excellent choice for telecom, IT, consumer, automotive, LED, and power supply applications which require a gap pad between heat generating components and heatsinks, and provides electrical isolation with the ability to absorb high tolerance stack-up."
As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets. For more information, please logon to www.lairdtech.com.
About Laird Technologies, Inc.
Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.
The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, specialty metal products, signal integrity components, and wireless antenna solutions, as well as radio frequency (RF) modules and systems.
Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, and industrial markets.
Laird Technologies, a unit of Laird PLC, employs over 10,000 employees in more than 39 facilities located in 13 countries.
Contact Information
For additional information, visit http://www.lairdtech.com or contact us at:
Americas: +1-888-246-9050 option 2 or CLV-customerservice@lairdtech.com
Europe: +49-(0)-8031-2460-0 or TIM-EUSales@lairdtech.com
Asia: +86-755-2714-1166 x374 or Thermal-ChinaSales@lairdtech.com
Trademarks
© 2010 All rights reserved. Laird Technologies and its logo are trademarks of Laird Technologies, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.
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