Elastomer BGA Socket is intended for testing eMMC devices.November 15, 2011 -
Designed for testing 0.5 mm pitch, 14 x 18 mm eMMC BGA device, SG-BGA-7219 connects all pins with 10 GHz bandwidth and operates with less than 1 dB insertion loss. Contact resistance is 20 mohm per I/O (typ), and mounting is accomplished via supplied hardware on target PCB without any soldering. Quick insertion method, using shoulder screws and swivel socket lid, accelerates IC change-out, while floating compression mechanism accommodates package manufacturing variations.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Ironwood Electronics, Inc.
P.O. Box 21151
St. Paul, MN, 55121
USA
Socket Your High-Density MLC NAND Flash & MMC Controller Using Elastomer Socket with Superior Electrical Performance
BURNSVILLE, MN - Ironwood Electronics has recently introduced a new high performance BGA socket for 0.5mm pitch, 14x18mm eMMC. eMMC describes an architecture consisting of an embedded storage solution with MMC (Multi Media Card) interface, flash memory and controller, all in a small ball grid array package. The SG-BGA-7219 socket is designed for testing eMMC BGA device and operates at bandwidths up to 10 GHz with less than 1dB of insertion loss. The contact resistance is typically 20 milliohms per I/O. The socket connects all pins with 10 GHz bandwidth on all connections. The socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint in the industry. The socket also incorporates a new quick insertion method using shoulder screws and swivel socket lid so that IC's can be changed out quickly. The socket also features floating compression mechanism to accommodate package manufacturing variations. The application of the socket is to verify the function of eMMC device that provides a flexible, industry-standard architecture that simplifies mass storage designs for portable consumer electronics products based upon the industry-standard MMC System Specification v4.41 and JEDEC BGA packaging standards. The specific package size accommodated by the socket is 0.5mm pitch, 14mm x 18mm, full array BGAs.
The SG-BGA-7219 sockets are constructed with high performance and low inductance gold plated embedded wire on elastomer as interconnect material between device and PCB. The temperature range is -35C to +100 C. The pin self inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 amps per pin.
Pricing for the SG-BGA-7219 is $1017 at qty 1.
For a high resolution photo see: http://www.ironwoodelectronics.com/press/PressReleasePhotos/C10049a_highres.jpg
Ila Pal
Vice President of Marketing
Ironwood Electronics
High Performance IC Sockets and Adapters
Phone: 800-404-0204
Email: ila@ironwoodelectronics.com
Skype: ila.pal
Web: http://www.ironwoodelectronics.com
Linkedin: http://www.linkedin.com/in/ilapal
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