EMI Shielding Film suits dynamic flex operations.
July 7, 2005 -
With total thickness of 22 microns, SF-PC5000 film is formulated for flex interconnects, COF, hinge applications in cellular phones, and LCD drivers. Base dielectric is 5 microns thick soft epoxy, covered with 0.1-0.15 microns of silver and 17 microns of Anisotropic Conductive Adhesive. Film exhibits thermal stability during reflow with no blistering or warpage, and minimal shrinkage. It comes with 50 micron PET transfer film and 120 micron film for protection.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Tatsuta System Electronics Co., Ltd
3-1, 2-chome, Iwata-cho, Higashi-Osaka City
Osaka, , 578-8585
Japan
Tatsuta Developed an Ultra-Thin Shielding Material for the Dynamic Flexing
Tatsuta System Electronics Co., Ltd released a new EMI shield film, SF-PC5000, formulated for flex interconnects, COF, hinge applications in cellular phones, digital camera modules and LCD drivers. With a total thickness of only 22 microns it is especially well suited for dynamic flex operations and acts as a covercoat in addition to its shield properties.
The base dielectric is a soft epoxy which is only 5 microns thick covered with 0.1-0.15 microns of silver and 17 microns of Anisotropic Conductive Adhesive. The film exhibits excellent thermal stability during reflow with no blistering, warp age and minimal shrinkage. SF-PC5000 comes with a mat black finish while the original shield film SF- PC1000 is silver. SF-PC5000 and 1000 comes with both a 50 micron PET transfer film for ease of handling and 120 micron film for protection.
Further information and samples are available from FRP Services & Company (America), Inc.
Phone: (914) 686-4090 Ext. 220
Email: pburghardt@frpusa.com
URL: www.frpservices.com
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