ThomasNet News Logo
Sign Up | Log In | ThomasNet Home | Promote Your Business

EDA Software cuts die-package interconnect planning time.

Print | 
Email |  Comment   Share  
May 30, 2014 - Used early in design cycle, Cadence® OrbitIO™ provides rapid planning of interfaces across multiple fabrics. As part of overall co-design solution, Cadence OrbitIO integrates with Cadence SiP Layout and Cadence Encounter® digital implementation platform, allowing design teams to clearly communicate design intent throughout flow. Software can enable fabless semiconductor or systems companies to evaluate package route feasibility, and communicate route plan to package design resources.

Cadence Announces New Integrated Solution for Rapid Die-Package Interconnect Planning


Cadence Design Systems, Inc.
2655 Seely Ave.
San Jose, CA, 95134
USA



Press release date: May 21, 2014

Enables concurrent optimization of multi-fabric elements, leading to lower cost and higher performance

SAN JOSE, Calif.,  -- Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced a new integrated solution to significantly cut down die-package interconnect planning time from weeks to days by reducing iterations between silicon and package design teams. The solution, built on Cadence(®) OrbitIO(TM) technology, also shortens the time to converge on the physical interface between the die and package up to 60 percent, all within the context of the full system.

Building on its leadership position for co-design in the implementation stage, Cadence OrbitIO technology is used earlier in the design cycle to provide rapid interconnect planning of high-performance interfaces across multiple fabrics. As part of an overall co-design solution, Cadence OrbitIO technology provides seamless integration with Cadence SiP Layout and the Cadence Encounter® digital implementation platform. This integrated solution allows design teams to clearly communicate design intent throughout the flow, resulting in better decision-making, fewer iterations and shorter cycle-times. It can enable fabless semiconductor or systems companies to evaluate package route feasibility, and allows them to communicate a route plan to their package design resources, whether it is to an internal group or to an outsourced assembly and test (OSAT) provider.

"The Cadence OrbitIO global view of system connectivity helps Faraday reduce the time required to converge on the optimal die bump to package ball pad assignment," said Dr. Wang-Jin Chen, senior technologist of Faraday. "The combination of connectivity optimization and route feasibility functions helped us produce a route plan resulting in two fewer package layers with all DDR signals implemented on a single package layer."

To learn more about OrbitIO technology, please visit: www.cadence.com/products/sigrity/orbitio/pages/default.aspx

About Cadence
Cadence  (NASDAQ: CDNS) enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.

© 2014 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo, and Encounter are registered trademarks of, and OrbitIO is a trademark of, Cadence Design Systems, Inc. in the United States and other countries.

For more information, please contact:
Cadence Newsroom
408-944-7039
newsroom@cadence.com

Web Site: http://www.cadence.com
Print | 
Email |  Comment   Share  
Contacts: View detailed contact information.


 

Post a comment about this story

Name:
E-mail:
(your e-mail address will not be posted)
Comment title:
Comment:
To submit comment, enter the security code shown below and press 'Post Comment'.
 



 See related product stories
More .....
 See more product news in:
Software
 More New Product News from this company:
EDA Software delivers foundry-certified SPICE-level accuracy.
PCB EDA/CAD Software enhances product design process.
Rapid Prototyping Platform supports low-power verification.
EDA Software offers tool for RC extraction.
More ....
| Featured Manufacturing Jobs
 Other News from this company:
Media Alert: Cadence to Showcase Latest System Connectivity and Analysis Technologies at PCB West 2014
Cadence Achieves PCIe 3.0 Compliance for PHY and Controller IP
Cadence and QNX Announce New Tensilica HiFi Audio/Voice DSP Application for In-Car Active Noise Control
Cadence Offers Production Proven USB 3.0 Host Controller IP
Cadence to Showcase Comprehensive PCI Express IP and Verification Solutions at PCI-SIG 2014
More ....
 Tools for you
Watch Company 
View Company Profile
Company web site
More news from this company
E-mail this story to a friend
Save Story
Search for suppliers of
Electronic Design Automation (EDA) Software
Join the forum discussion at:
Engineers Lounge




Home  |  My ThomasNet News®  |  Industry Market Trends®  |  Submit Release  |  Advertise  |  Contact News  |  About Us
Brought to you by Thomasnet.com        Browse ThomasNet Directory

Copyright © 2014 Thomas Publishing Company. All Rights Reserved.
Terms of Use - Privacy Policy



Error close

Please enter a valid email address