Dual Core Communications Processor targets LTE smartphones.February 22, 2012 -
Based on Mobile modem with multi-mode FDD and TDD-LTE Category 4 capabilities, 1.5 GHz Model MP5232 enables OEMs to accelerate creation and delivery of high volume LTE/HSPA+ capable smartphones, tablets, and mobile Internet devices. Application processor provides multi-core computing power with optimized graphics, video, and imaging capabilities. Delivered fully tested and certified, chip also includes advanced RF transceivers, power management, and audio solutions.
Original Press release
Renesas Technology America, Inc.
450 Holger Way
San Jose, CA, 95134-1368
USA
Renesas Mobile Introduces First Integrated LTE Triple-Mode Platform Optimised for Full Featured, High Volume Smartphones
MP5232 Dual 1.5GHz core Communications Processor to Drive LTE Growth with Best-in-Class User Experience for High Volume LTE Smartphones and Tablets
TOKYO, -- Renesas Electronics Corporation (TSE: 6723) and its subsidiary, Renesas Mobile Corporation (http://www.renesasmobile.com), a leading supplier of advanced cellular semiconductor solutions and platforms, today announced the availability of the MP5232, the first single-chip, high-performance, scalable smartphone platform optimised to address the US$150-300 range device market. The MP5232 platform is designed to enable OEMs to accelerate the creation and delivery of high volume LTE/HSPA+ capable smartphones, tablets and mobile Internet devices the industry requires to deliver the full potential of LTE.
The MP5232 platform sets a new benchmark in terms of levels of integration and performance for fully featured high-volume LTE devices. At its heart, the Renesas Mobile modem, deployed in over two billion devices to date, delivers the industry's highest throughput and low power multi-mode FDD and TDD-LTE Category 4 capabilities. Combined with a state-of-the-art application processor the platform delivers a no-compromise user experience with multi-core computing power, industry-leading graphics, video and imaging capabilities. The platform also includes advanced RF transceivers, power management and audio solutions. This highly integrated smartphone platform is delivered fully tested and certified to enable customers to bring new generations of fully-featured LTE/HSPA+ smartphones to market in as little as six to nine months.
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