Dry Drip Systems offer throughput of 180 wafers/hour.March 13, 2003 - FusionGemini ES and FusionGemini Plasma Asher offer increased throughput of up to 180 wafers per hour for front-end-of-line (FEOL) and back-end-of-line (BEOL) cleaning applications. Downstream microwave design provides photoresist and polymer removal, while avoiding plasma charge damage. FusionGemini ES systems include H2O vapor-assisted process, where use of H2O vapor enhancement optimizes dry polymer removal process for FEOL and BEOL applications.
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Original Press release
Axcelis Technologies Inc.
55 Cherry Hill Dr.
Beverly, MA, 01915 1053
USA
Axcelis Introduces Faster FusionGemini Dry Strip Systems
FusionGemini ES and FusionGemini Plasma Asher increase throughput capability for volume manufacturing needs
BEVERLY, Mass. - March 11, 2003 - Axcelis Technologies Inc. (NASDAQ: ACLS), has developed significant enhancements for its FusionGemini ES and FusionGemini Plasma Asher dry strip systems. The latest innovations to evolve from Axcelis' continuous improvement programs, these enhancements give chipmakers a highly flexible dry strip process with a 40 percent improvement in throughput for high volume manufacturing operations.
With more than 600 systems installed worldwide, Axcelis' FusionGemini platform is recognized for its wide process window to handle a variety of dry strip and polymer removal applications. The enhanced FusionGemini ES and FusionGemini Plasma Asher systems offer improved process performance and increased throughput of up to 180 wafers per hour for front-end-of-line (FEOL) and back-end-of-line (BEOL) cleaning applications. The downstream microwave design provides efficient photoresist and polymer removal, while avoiding plasma charge damage. The new features are also available as an upgrade to existing FusionGemini ES and FusionGemini Plasma Asher systems.
"These latest enhancements to the FusionGemini platform reinforce our commitment to process and throughput improvements for our customer base," said Jan-Paul van Maaren, vice president and general manager of Axcelis Curing and Cleaning Systems. "Axcelis continues to explore new ways to make the cleaning process more efficient and cost effective. These enhancements combine the flexibility of the FusionGemini ashers with very high throughput and process performance."
Axcelis' continuous improvement process has led to numerous other Cleaning Systems enhancements, including the recent H20 vapor-assisted process for the company's FusionGemini ES systems. Use of the H2O vapor enhancement optimizes the dry polymer removal process for FEOL and BEOL applications, enabling subsequent wet processing steps to be carried out in a significantly shorter time with less wet chemical consumption.
About Axcelis Technologies, Inc.
Axcelis Technologies, Inc., headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation, rapid thermal processing, and cleaning and curing systems. Axcelis Technologies has key technology centers in Beverly, Massachusetts, and Rockville, Maryland as well as in Toyo, Japan through its joint venture, SEN. The company's Internet address is: www.axcelis.com.
Contact:
Stacy Grisinger
Loomis Group
(617) 638 0022
grisingers@loomisgroup.com
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