Detection/Configuration IC enhances audio headset experience.
June 27, 2012 -
Offered in 16-pin QFN and WCSP packages, TS3A225E enables universal headset support for audio applications in one chip. This switch eliminates detection, leakage, and click-pop issues caused by using discrete components in end-equipment such as smartphones, tablets, laptops, and audio docks by integrating automatic detection and switching functions in one device. Solution supports 3-prong (without microphone) and 4-prong (with microphone) audio headsets from all manufacturers.
|Original Press release |
Texas Instruments, Inc. (TI)
12500 TI Blvd.
Dallas, TX, 75243-4136
TI Enhances Audio Headset Experience with Detection and Configuration Switch IC
New switch automatically detects headset type to ease system design
DALLAS -- Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a new audio headset detection and configuration switch integrated circuit (IC) that enables universal headset support for audio applications in a single chip. By integrating the automatic detection and switching function in a single device, the TS3A225E eliminates detection, leakage and click-pop issues caused by using discrete components in end-equipment, such as smartphones, tablets, laptops, audio docks and home audio applications. For more information and to order samples, visit www.ti.com/ts3a225e-pr.
The TS3A225E works seamlessly to extend the functionality of best-in-class TI audio codecs, such as TLV320AIC3262 and TLV320AIC3212. For customers who prefer only a 2x2 crosspoint switch functionality without headset-type detection, TI also offers the reduced-cost TS3A26746E. The TI switch portfolio also consists of other audio, video, USB, LAN and DDR switches available at www.ti.com/switches-pr.
Key features and benefits
-- Enhances the end user's experience: supports three-prong (without microphone) and four-prong (with microphone) audio headsets from all manufacturers.
-- Eases system design: detects the configuration of the microphone and ground pins on a four-prong headset and routes them appropriately via a 2x2 crosspoint switch.
-- More control over system operation and debug: reports headset information over I2C interface.
-- Prevents audio signal distortion: 66-percent lower on-resistance (100 mOhms) for the ground switch compared to the competition.
-- Easier mounting and routing in the system: available in both QFN and WCSP packages.
Availability, packaging and pricing
Available now, the TS3A225E is offered in 16-pin QFN and WCSP packages. Suggested retail pricing is $0.32 in 1,000-unit quantities.
Learn more about TI's audio and switch portfolios by visiting the links below:
-- Order TS3A225E samples, HSpice models and evaluation modules: www.ti.com/ts3a225e-pr.
-- See the TI switch portfolio: www.ti.com/switches-pr.
-- View a tablet system block diagram: www.ti.com/tabletsbd-pr.
-- View a smartphone system block diagram: www.ti.com/smartphonesbd-pr.
-- Ask questions and help solve problems with fellow interface engineers in the TI E2E(TM) Community: www.ti.com/audioforum-pr.
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