Conduction-Cooled VPX Enclosure has no-tool board changes.September 3, 2008 -
Offering COTS modular chassis for VPX/VME/CPCI/CPCIe, ARINC600-ATR enclosures enable accelerated development of rugged conduction-cooled, embedded systems for airborne applications. Products are offered with interchangeable backplane-bus versions, and each slot has its own rear I/O PCB to facilitate definition and testing of custom wiring. This setup can be exchanged with custom rear I/O PCB set. Loaded via front, boards are fixed in place with self-clamping wedge locks.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
PCI Automation Inc
2600 Strawberry Court
Antioch, CA, 94509
USA
PCI-SYSTEMS Inc. Unveils New VPX Conduction Cooled ARINC600-ATR Enclosure
Laurel, MD
August 25, 2008-PCI-SYSTEMS Inc. a leading supplier of conduction cooled systems, today announced NEW VPX Conduction Cooled ARINC600-ATR Enclosures that need NO tools for changing boards, enabling accelerated development of rugged conduction cooled embedded systems for airborne applications and also providing a fast repair time if needed.
ARINC600 Version
ATR Version
PCI-SYSTEMS Inc. manufactures a variety of COTS modular designed conduction cooled chassis for VPX, VME, CPCI and CPCIexpress applications.
Two level maintenance models include ATR, ARINC600 and custom chassis and all are available with interchangeable backplane-bus versions.
Also, during development, each slot has its own rear I/O PCB to ease definition and testing of the final custom wiring. This setup can be easily exchanged with a custom rear I/O PCB set. Therefore cost of ownership is minimized, since development and production versions of the chassis have the same basic design components.
VPX versions are available with a PCIexpress bus implementation on the backplane, having 8 lanes per slot and a 64 lane switch, therefore allowing up to 7 add-on slots and a CPU slot for very high bandwidth computing applications.
Current CPU boards are available with x4 or x8 lane PCIexpress configuration and include a Intel core duo board based on the Intel 3100 chipset with ECC and a Freescale MPC8572E CPU dual core PowerPC processor board.
The ARINC600/ATR Conduction Cooled Chassis shown here comes with a 6 slot backplane plus CPU slot, 220 Watt Modular PS with 12-36VDC input and an external AC input adapter for lab testing. There is an add-on sheet metal hood available to generate a duct around the chassis. Therefore this chassis type can be installed into any aircooled rack in the aircraft bay. VME, CompactPCIexpress Type 3, CompactPCI and VPX backplanes with Rear I/O are available.
PCI-SYSTEMS Inc. unique front loading of boards allows easy maintenance requiring NO tools. The wedge locks are self-clamping when the ejector is pushed to the front of the conduction cooled carrier.
The chassis is manufactured from aluminum to guarantee maximum ruggedness at minimum weight. Power dissipation of the installed boards and power supply is by conduction cooling through the walls of the chassis and cooling fins.
Boards are fixed in place with self-clamping wedge locks to insure good heat conduction to the chassis and vibration control.
This is an ideal solution as a hardware/software development platform and can be easily upgraded for full rugged projects.
PCI-SYSTEMS Inc. manufactures a variety of conduction cooled carrier boards for different bus architectures and can customize mechanical shapes and layout changes even for small quantities with fast turnaround times.
"Very few high volume applications can justify the design of a custom conduction cooled chassis, stated Claus Gross, PCISYSTEMS Inc.'s Vice President of Engineering. "For cost reasons the majority of designs must utilize a modular design made with off-the-shelf components. SYSTEMS Inc. delivers complete systems within a short time frame" Until recently, Mr. Gross explained, OEM's had to design a chassis by immediately using customized rear I/O and also determine the type of external cooling. Many designers had to design their own backplane into their application, in spite of the extended design time. "With our modular approach of delivering exchangeable backplane types and different chassis parts for different cooling options, the migration path from prototyping to a mission computer is done very fast " he stated, "designers have a magnificent choice: combine a proven low cost mechanical subsystem and basic electronics like carriers for XMC-PMC cards and a power supply without packaging or form-factor constraints to their application. Most chassis have a delivery time of less than 4 weeks"
PCI-SYSTEMS Inc. develops and manufactures intelligent CPU and peripheral boards as well as advanced mechanical design solutions in the US and Germany for many platforms that provide precision control of robotic and automated equipment in the semiconductor, medical and industrial equipment markets as well as for ruggedized embedded OEM applications in airborne and defense applications.
Contact:
USA
PCI-Systems Inc.
13 C Street, Suite D
Laurel, MD 20707
Tel: 301-358-3621
(301) 362-1233
Europe
PCI embedded computer systems GmbH
Lehrstr.31
D-63128 Dietzenbach
Tel:xx-0-6074-35108
FAX:xx-0-6074-35114
Please enquire to sales@pcisystems.com
Website www.pcisystems.com
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