Composite Material suits multilayer RF and high frequency PCBs.June 1, 2011 -
Combining non-polar thermoset resin system with controlled-expansion ceramic filler and low-loss thermoplastic material, GenClad 280 matches electrical performance of PTFE laminate systems, but supports multilayer designs. RoHS-compliant product offers low dielectric constant and loss of 2.8/0.002 at 10 GHz, low water absorption of 0.04%, and stable dielectric constant over frequency and temperature. Material adheres to variety of PTFE and other RF/microwave cores.
Original Press release
Arlon Electronic Substrates
9433-T Hyssop Dr.
Rancho Cucamonga, CA, 91730
USA
Arlon Introduces New Composite Material
Rancho Cucamonga, CA--Arlon Materials for Electronics announces the introduction of GenClad 280 bond-ply, a proprietary woven fiberglass reinforced, ceramic-filled composite material engineered for optimal cost/performance efficiency in multilayer RF and high frequency printed circuit boards. Combining a non-polar thermoset resin system with controlled-expansion ceramic filler and a low-loss thermoplastic material, GenClad offers next generation electrical performance that matches the electrical performance of traditional PTFE laminate systems, but offers designers the ability to use cost-effective multilayer designs.
GenClad 280 is engineered for use in bonding dissimilar and hard to bond materials in multilayer PCB structures, particularly in high speed and microwave applications. Compatible with PTFE laminate materials, GenClad 280 prepreg processes in conventional FR-4 lamination cycles, yet offers a unique combination of properties for high speed, high frequency multilayer applications:
- Low dielectric constant and loss (2.8/0.002 at 10 GHz)
- Low water absorption (0.04%)
- Stable dielectric constant over frequency and temperature
- Excellent adhesion to a variety of PTFE and other RF/microwave cores
- High Decomposition Temperature (443oC) and T288 (>>60 sec) for lead-free solder compatibility
- Low Z-direction CTE (45-50 ppm/oC) for enhanced PTH reliability
- ROHS Compliant
Arlon representatives will be highlighting GenClad 280 and other high performance microwave materials at the upcoming 2011 IEEE International Microwave Symposium (Booth#4613). Contact Arlon Material for Electronics at 866-394-6508 or visit www.arlon-med.com for additional information on GenClad 280 and other high performance Arlon materials.
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