Central Processing Unit consumes only 31 W.
April 12, 2006 -
Utilizing Intel® E7520 chipset, EUROCOM® 400 CPU features 2.0 GHz LV Dual-Core Intel® Xeon® processor with dual CPU capabilities in combination with COM Express platform. Module architecture enables fast, simultaneous data transfer on multiple channels. Up to 4 GB of RAM can be implemented. Carrier board with complete I/O for development purposes and standard production applications is available.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
American Eltec Inc
101 College Rd East
Princeton NJ, , 08540
USA
New EUROCOM® 400 From American Eltec Is COM Express CPU With Latest Dual-Core Intel® Xeon® Lv 2.0 GHz Processor For Windows®, Linux And Real-Time Operating Systems
Las Vegas, NV, April 2006 - The new EUROCOM® 400 CPU from American ELTEC features the new Dual-Core Intel® Xeon® processor LV 2.0 GHz with dual CPU capabilities in combination with the COM Express platform - the new PICMG-defined form factor for computers on modules that replaces the ETX standard.
"If you are looking for a high-performance CPU on a COM module, the EUROCOM® 400 provides a server-class dual-core Intel® Xeon® processor LV 2.0 GHz," said Martin Goerner, Sales Director for ELTEC worldwide. "This CPU is a version of the "Core Duo" mobile CPU, optimized for I/O throughput and highest reliability. The COM architecture allows the complete functionality of a computer to be jam-packed onto a small module, even including full server computing power."
This unique combination of processor and chip set offers the high performance of Intel's Dual-Core Xeon® processor technology with the low power consumption of the ELTEC CPU: 31 watts.
The EUROCOM® 400 also utilizes the Intel® E7520 chipset, which provides a basis on the COM Express module for higher system performance in combination with the 8-lane PCI Express connection to the carrier board. The architecture of the modules enables fast data transfer simultaneously on multiple channels (e.g. Gbit Ethernet, simultaneous RAID access and process data transfer). Up to 4 GBytes of RAM (also with ECC) can be implemented.
Another distinctive feature of the EUROCOM® 400 module is the availability of graphics - SM 712 with internal graphics. The combination of graphics and server performance brings a new level of performance to wide array of industrial applications. A carrier board with complete I/O for development purposes and standard production applications is available for the EUROCOM® 400 COM Express module.
Dieter Gebert, Chairman of the board of directors of American ELTEC's parent company, ELTEC Elektronik AG, stated: "The EUROCOM® 400 module originated from a close cooperation with Intel, which means that ELTEC can bring the newest technology faster to our industrial automation customers, and it establishes the high technological level ELTEC has been known for."
Bill Rollender, Product Marketing Manager, Intel Infrastructure Processor Division stated: "Intel works with many important board manufacturers, like ELTEC, who support the latest Intel® technology such as the Dual-Core Intel® Xeon® processor LV 2.0 GHz. The EUROCOM® 400 COM Express board is just the first of many projects we are working on with the ELTEC development team."
Pricing for the EUROCOM® 400 CPU board is $1,499 in single piece quantities.
For additional information, contact American ELTEC, Inc., Quail Park IV, Suite 57,
2810 W. Charleston Ave., Las Vegas, NV 89102. Tel: 702-878-4085; Fax: 702-878-4735. E-mail: janet.ferris@americaneltec.com; Web: www.americaneltec.com.
Reader Service Inquiries: Please send to Janet Ferris at American ELTEC Inc.,
Quail Park IV, Suite 57, 2810 W. Charleston Ave., Las Vegas, NV 89102. Tel: 702-878-4085; Fax: 702-878-4735. E-mail: janet.ferris@americaneltec.com.
Intel® and Xeon® are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Windows® is a registered trademark of Microsoft Corp.
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