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Capacitive Demodulator suits high-resolution measurement tasks.

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Capacitive Demodulator suits high-resolution measurement tasks.
Capacitive Demodulator suits high-resolution measurement tasks.
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January 17, 2014 - Based on modular design principle, DL 6230 Demodulator for capacitive displacement and distance measurement sensors can be operated with up to 4 channels using DT6200 controller. These additional channels can be added/removed by user without impacting software performance and operation. With demodulator, capaNCDT 6200 is used to measure thickness, tilt angle, and vibrations at sub-micrometer to nanometer precision levels. It has Ethernet interface and is operated via web browser interface.

New Capacitive Demodulator for High-Resolution Measurement Tasks


MICRO-EPSILON AMERICA
8120 Brownleigh Dr.
Raleigh, NC, 27617
USA



Press release date: January 14, 2014

At the end of 2012, Micro-Epsilon launched the capaNCDT 6200 capacitive measuring system that can be extended by up to four measurement channels using demodulators. A new addition is the DL 6230 demodulator, which provides up to 8 times higher resolution for reaching even higher performance levels.

Micro-Epsilon has launched the new DL 6230 demodulator module for capacitive displacement and distance measurement sensors. The new demodulator has a resolution up to 8 times higher than its predecessor. All capacitive displacement sensors from Micro-Epsilon can be connected to the DL 6230 with no further calibration required.

The demodulator modules mean that the control unit is based on a modular design principle and can be operated using up to four measurement channels. These additional channels are added (and removed) by the user without impacting on software performance or operation. The capaNCDT 6200 has an Ethernet interface and is operated via a web browser. Customer-specific configurations can be saved to increase the accuracy of measurement results.

The capacitive measuring system with its DL 6230 demodulator modules can be used to measure thickness, tilt angle and vibrations, from sub-micrometre to nanometre precision levels, such as those required by the semiconductor industry.
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