CSP Production Line produces 2,000,000 devices per week.
May 7, 2004 - Chip Scale Package (CSP) Production Line electrically sorts, laser marks, visually inspects, tapes, and reels multiple wafer scale devices such as standard or bumped die as small as 0.5 mm² and QFN packages. Inkless process, based on wafer mapping program, electronically merges bump maps, electrical sort maps, and vision inspection maps into one composite map that controls selection and taping of devices. Punch-through tape allows die to be removed from either side of finished tape.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Best Electronics and Components Company, Inc. (BECCI)
4655 Old Ironsides Dr. Suite 215
Santa Clara, CA, 95054
USA
Faster Time to Market with New High Volume Chip Scale Package Production Line
New CSP production line throughput of 2,000,000 devices per week serves rapidly expanding market for ultra small analog and mixed signal integrated circuits
FOR IMMEDIATE RELEASE â Best Electronics and Components Company, Inc. (BECCI) U.S. Export Authority, Inc 4655 Old Ironsides Dr. Suite 215, Santa Clara, CA 95054 USA
T 408-980-9383, F 408-980-1130, usea@usea.com, www.usea.com
CONTACT: Joanna Laznicka of Phaze-9 Corp., 415 South Mary Suite 14 Sunnyvale CA, 94086, P (408) 245-5117, joanna@phaze-9.com
Santa Clara, California â Best Electronics and Components Company, Inc. (BECCI), a contract test facility for analog and mixed signal semiconductors, announced today that it has successfully established a high volume Chip Scale Package (CSP) Production Line.
The new CSP production line can electrically sort, laser mark, visually inspect, tape, and reel multiple wafer scale devices such as standard or bumped die as small as 0.5 mm square and QFN packages at production volumes of 2,000,000 devices per week.
Bestâs new CSP production line uses a totally inkless process based on an advanced wafer mapping program, developed by Best, that electronically merges bump maps, electrical sort maps, and vision inspection maps for all formats into one composite map that controls the selection and taping of all devices. This inkless electronic mapping process eliminates unnecessary manufacturing operations, increases the quality level, and increases production through-put by 400 %. The new CSP production line features a âpunch-throughâ tape that allows customers to remove die from either side of the finished tape..
âOur new CSP capability will enable Best to serve the rapidly expanding market for ultra small analog and mixed signal integrated circuits used in cell phone, PDA, and RFID applicationsâ said Fred Kinder, President of Best Electronics. âBest Electronics was able to integrate the new Chip Scale Packaging service for our customers because we made the necessary capital investments in new equipment last year during the downturn. The centerpiece of our new CSP line is the high speed Ismeca WT-32 die inspection and tape & reel equipment. â
About Best Electronics & Components Company Inc.
Established in 1992, Best Electronics & Components Company Inc. (BECCI) offers total parametric and functional test solutions for analog and mixed signal integrated circuits. BECCI is specifically configured for low cost, high volume, wafer sorting, and final testing of chip scale and packaged circuits. This allows customers to have additional capital available for design of new products or reserve capital for other needs. Best provides a complete spectrum of engineering and manufacturing services to support these products, i.e., test program development & conversion, wafer backlapping and sorting, sawing, assembly, electrical test, tape & reel, burn-in, and drop shipments to end customers.
For more information please visit www.usea.com
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