COM Express Modules utilize 3rd Gen Intel® Core(TM) technology.
March 1, 2013 -
Equipped with Intel HM76 Express Chipset, conga-TS77 and conga-BS77 are available with 2.20 GHz dual-core Intel® Celeron® Processor 1020E, 1.40 GHz dual-core Intel Celeron Processor 1047UE, or 1.50 GHz single-core Intel Celeron Processor 927UE. Modules offer up to 16 GB of dual-channel DDR3 memory plus direct support for USB 3.0 and Intel Hyper-Threading Technology. Additional features include 7 PCI Express 2.0 lanes, PCI Express Graphics 3.0 x 16 lanes, 4 SATA ports, and 1 Gb Ethernet interface.
|Original Press release |
Congatec Presents: COM Express Entry Modules with Intel® Celeron® Dual-Core Processors for 3rd Generation Intel® Core(TM)
Deggendorf, Germany -- congatec AG, a leading manufacturer of embedded computer modules, introduces Intel® Celeron ® Dual-Core processors with 3rd Generation Intel® Core™ technology for the conga-TS77 (type 6) and conga-BS77 (type 2) COM Express modules. The modules provide impressive performance and improved energy efficiency at a low price point.
The conga-TS77 and conga-BS77 modules are now available with the following new processor variants: Dual-Core Intel® Celeron® Processor 1020E (2M Cache, 2.20 GHz, 35W TDP); dual-core Intel® Celeron® Processor 1047UE (2M Cache, 1.40 GHz, 17W TDP); single-core Intel® Celeron® Processor 927UE (1M cache, 1.50 GHz, 17W TDP).
The modules come with the new mobile Intel® HM76 Express Chipset, offer up to 16GB of dual-channel DDR3 memory (1600 MT/s) plus direct support for USB 3.0 and Intel® Hyper-Threading Technology.
The key innovations of the 3rd Generation Intel® Core™ processors include design with 3D tri-gate transistors, 22-nanometer manufacturing and tighter integration of the Intel® HD graphics core.
The COM Express modules have seven PCI Express 2.0 lanes, PCI Express Graphics 3.0 (PEG) x16 lanes for high-performance external graphics cards, four SATA ports with up to 6Gb/s, RAID support and a 1-Gbit Ethernet interface for fast and flexible system extensions. Fan control, LPC bus for easy integration of legacy I/O interfaces and Intel High Definition Audio complete the feature set, says the company.