CMOS Sensor targets ultra slim smartphones.August 10, 2011 -
Built on 1.1 micron OmniBSI-2 pixel architecture, ¼ in. 8 megapixel CameraChip(TM) OV8850 fits in 8.5 x 8.5 mm autofocus camera module with build height of 4.7 mm. Unit features on-chip temperatures sensor, 2 phase lock loops, context switching, and alternate row exposure for HDR video and still image capture. Integrated scaler allows camera to maintain full field of view in 1080p/30 HD video and preview modes and provides additional adjustable resolution for electronic image stabilization.
Original Press release
OmniVision Technologies, Inc.
1341 Orleans Dr.
Sunnyvale, CA, 94089
USA
Omnivision Launches First Sensor with 1.1-Micron Pixel
Latest OmniBSI-2(TM) Pixel Enables 1/4-Inch, 8-Megapixel Mobile Camera Solution for Ultra Slim Smartphones
SANTA CLARA, Calif., -- OmniVision Technologies, Inc. (NASDAQ: OVTI), a leading developer of advanced digital imaging solutions, today introduced the 8-megapixel OV8850, the first CameraChip(TM) sensor built on a 1.1-micron OmniBSI-2 pixel architecture. The 1/4-inch OV8850 leads the CMOS sensor pixel design race in the smartphone market by enabling autofocus modules that are 20 percent slimmer than any 8-megapixel module in commercial use today. Besides a small footprint, the 1.1-micron OmniBSI-2 pixel offers significant improvements in power efficiency and image quality comparable to the previous generation 1.4-micron OmniBSI(TM) pixel, making it an attractive solution for next-generation smartphones and tablets.
"With our new OmniBSI-2 architecture, we have further miniaturized our pixels while delivering a 20 percent improvement in peak quantum efficiency in all color channels, a 35 percent improvement in low-light sensitivity and a 45 percent increase in full-well capacity in an extremely compact and power efficient package," said Per Rosdahl, senior product manager at OmniVision. "This 1.1-micron OmniBSI-2 pixel enables the next generation of miniaturization in mobile cameras, and is key to the high-resolution smartphone camera roadmap."
Besides its advanced pixel design, the OV8850 also features advanced imaging functions, such as an on-chip temperature sensor, two phase lock loops, context switching, and alternate row exposure for high dynamic range (HDR) video and still image capture. An integrated scaler allows the camera to maintain full field of view in 1080p/30 high-definition (HD) video and preview modes and provides additional adjustable resolution for electronic image stabilization (EIS). The sensor's 2 x 2 binning functionality provides enhanced 720p/60 HD video recording with EIS, an absolute must in today's advanced mobile devices.
The OV8850 fits in an 8.5 x 8.5mm autofocus camera module with a build height of 4.7 mm. Sampling will begin in August, with mass production expected in the first calendar quarter of 2012.
About OmniVision
OmniVision Technologies (NASDAQ: OVTI) is a leading developer of advanced digital imaging solutions. Its award-winning CMOS imaging technology enables superior image quality in many of today's consumer and commercial applications, including mobile phones, notebooks, tablets and webcams, digital still and video cameras, security and surveillance, entertainment devices, automotive and medical imaging systems. Find out more at http://www.ovt.com.
OmniVision® and the OmniVision logo are registered trademarks of OmniVision Technologies, Inc. OmniBSI(TM), OmniBSI-2(TM) and CameraChip(TM) are trademarks of OmniVision Technologies, Inc. All other trademarks are the property of their respective owners.
Web Site: http://www.ovt.com
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