Bus Converter offers over 800 W/in3 power density.
October 1, 2008 -
Featuring 94.5% efficiency, VIB0101THJ, 120 W, 1/32nd brick footprint BCM(TM) bus converter is 48-12 V surface-mount, non-regulated half-chip unit enabling low impedance interconnect to system board. Utilizing Sine Amplitude Converter (SAC(TM)) for power density of 840 W/in3, it also features low junction-to-board and junction-to-case thermal resistance. It can be used to power non-isolated POL converters or as isolated voltage source for various applications.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Vicor Corp.
25 Frontage Rd.
Andover, MA, 01810 5424
USA
VoI Chip, Inc. Introduces 120 W 'Half-Chip' Bus Converter with >800 W/in3 Power Density
Andover, MA, September 15, 2008... VoI Chip, Inc. a subsidiary of Vicor Corporation (NASDAQ: VICR) announced the availability of a 120 W, 1/32nd brick footprint BCM(TM) bus converter. The VIB0101THJ is a 48 V to 12 V surface-mount, non-regulated converter with 94.5 percent efficiency and may be used to power non-isolated POL converters or as an isolated voltage source for ATE, server, telecom and industrial control applications.
The VIB0101THJ uses a Sine Amplitude Converter (SAC(TM)) for a high power density of 840 Watts per cubic inch. The half inch square 'half-chip' package enables a low impedance interconnect to the system board and reduces the power system volume by 75 percent versus similar power-level converters. The VoI Chip package provides flexible thermal management through its low junction-to-board and junction-to-case thermal resistance. The BCM's low impedance SAC enables a 16x capacitance reduction - eliminating the need for limited-life aluminum electrolytic or expensive tantalum bulk capacitors. The bus converter increases overall system efficiency and lowers operating costs compared to conventional approaches.
"The small size and high power density of this new 120 Watt high-efficiency BCM gives power designers new options," said Stephen Oliver, VP Marketing and Sales. "It's the first of our new half-chip products and offers layout flexibility, a minimized power converter footprint and an easy design for fast time-to-market."
The BCM bus converter package is compatible with standard pick-and-place and surface-mount assembly processes. The VIB0101THJ is priced at $19.85 in OEM quantities and is available from stock. To order, contact Vicor Customer Service at 800-735-6200 or e-mail custserv@vicr.com.
For a data sheet and more information on the VIB0101THJ and other VoI Chip products, including application notes and demonstration boards, please visit www.vicorpower.com.
VoI Chip Inc. specifies, designs, manufactures and markets VoI Chip power components to enable next-generation power architecture in high-end computing, ATE, telecom, solid-state lighting, and defense electronics markets worldwide.
Vicor Corporation designs, develops, manufactures and markets modular power components and complete power systems used primarily by original equipment manufacturers (OEMs) in the communications, data processing, industrial control, test equipment, medical, and defense electronics markets.
Bus Converter Module (BCM), Sine Amplitude Converter (SAC), VoI Chip, and Vicor Corporation are trademarks of Vicor Corporation.
|
|
|
|
|
|
|
| 
